Thermal Conductive Pad
Green Thermal Gap Filler Pad 45 Shore 00 2.0W/mK Thermal Conductive Pad for IGBT Panels
TIF 140-20-18 series thermal gap filler pad with 2.0W/mK conductivity, 45 Shore 00 hardness, and 0.5-5.0mm thickness. Naturally tacky, soft, compressible, and RoHS compliant. Ideal for IGBTs, LED power supplies, and automotive electronics. Custom die-cut and adhesive options available.
Thermal Conductive Silicone Pad 1.5 W/mK for CPU GPU Laptop Graphics Card Heat Dissipation
TIF180-02F series silicone pad offers 1.5 W/mK thermal conductivity, soft compressibility, and natural tack. Available in 0.5mm to 5.0mm thickness with custom die-cut options. UL 94 V0 rated, ISO certified. Ideal for CPUs, GPUs, and power electronics.
2.0W/mK Soft Silicone Thermal Pad 0.51mm to 5.08mm for Low Stress Heat Dissipation
Ultra-soft ceramic-filled silicone thermal pad with 2.0W/mK conductivity. Naturally tacky, UL 94 V0 rated, and RoHS compliant. Ideal for motherboards, power supplies, and automotive electronics. Custom thicknesses and adhesive options available.
Fiberglass Reinforced Thermal Gap Filler Pad 0.5mm 1.5W/mK 55 Shore00 for Tablet PC
TIF140FG-05S thermal pad offers 1.5W/mK conductivity, 0.5mm thickness, and fiberglass reinforcement. Soft, compressible, naturally tacky, UL recognized, RoHS compliant. Ideal for CPUs, LEDs, and ultra-thin devices.
High Thermal Conductive Silicone Pad 2.0W/mK for Automotive Electronics Gap Filler 0.5mm to 5mm
TIF140-20-02S is a ceramic filled silicone elastomer pad with 2.0W/mK thermal conductivity and UL94 V0 flame rating. Soft, compressible, and naturally tacky for low-stress assembly. Ideal for automotive ECUs, LED lighting, and telecom hardware. Custom thickness and adhesive options available.
1.5W Thermal Pad for PC Cooling Gap Filler 0.5mm to 5mm Thickness
Ultra-soft ceramic-filled silicone thermal pad with 1.5W/mK conductivity. Low assembly stress, high conformability. UL recognized, RoHS compliant. Custom thicknesses from 0.5mm to 5mm. Ideal for CPU, GPU, and power electronics.
TIF™800 Series Silicone Thermal Conductive Pad 5.0W/mK, 40 Shore 00, -50 to 200°C Temperature Range
High-performance silicone thermal conductive pad with 5.0W/mK thermal conductivity and 40 Shore 00 hardness. Electrically isolating material suitable for CPU, GPU, and electronics cooling applications. UL94 V-0, SGS, and ROHS compliant. Available in thicknesses from 0.25mm to 5.08mm for various thermal management needs.
Gray Compressible Thermally Conductive Heat Sink Cooling Pad 1.5 W/mK 0.5mm to 5.0mm for Memory Modules
TIF160-02F series thermally conductive pad with 1.5 W/mK conductivity, soft and compressible for low stress applications. Fills air gaps between heating elements and heat sinks, enhancing efficiency and lifetime. UL 94 V0 rated, customizable thickness and adhesive options.
Ultra Soft Thermally Conductive Gap Pad 1.5 W/mK Silicone Filler for Low Stress Applications
TIF120-02F series ultra soft thermal gap pad with 1.5 W/mK conductivity, 60 Shore 00 hardness, and >5500 VAC dielectric strength. Naturally tacky, RoHS compliant, available in 0.254–5.080 mm thickness. Ideal for CPUs, power supplies, and automotive electronics.
2W Grey Thermal Conductive Pad 2 W/mK for Electrical Components 0.25mm-5mm
TIF®140-20-11E thermal pad offers 2 W/mK conductivity, self-adhesive design, and good softness for effective heat transfer. UL94 V-0 certified, available in custom shapes and thicknesses. Ideal for CPUs, LEDs, power modules, and automotive ECUs.
3W Thermal Conductive Pad TIF140-30-02S White-Grey 0.762mm for Wireless Routers
TIF140-30-02S is a 3W/mK ceramic-filled silicone thermal pad with natural tack, soft compressibility, and thickness options from 0.25mm to 5.08mm. Ideal for gap filling, insulation, and damping in wireless routers and electronics. UL 94 V0 rated, ISO certified, with custom die-cut and adhesive options.
High Stickiness Silicone Thermal Conductive Pad 2W/mK Violet for PCB CPU LED -50 to 200C
TIF180-20-16E series thermal pad with 2.0 W/mK conductivity, high tack surface, and wide temperature range. Soft, compressible, UL recognized, RoHS compliant. Ideal for CPUs, LEDs, and PCBs. Custom thicknesses available.
Naturally Tacky 1.5 W/mK Silicone Thermal Conductive Pad 45 Shore00 for LED Controller
TIF 100-10S silicone gap pad offers 1.5 W/mK thermal conductivity, low hardness, and electrical isolation. Ideal for LED controllers, automotive, and telecom. UL V-0 rated, customizable thickness, and available with adhesive options.
2W/mK Thermal Conductive Silicone Pad 0.5mm to 5mm for CPU GPU Heat Dissipation
Soft, compressible silicone gap pad with 2.0W/mK thermal conductivity. UL94 V-0 rated, electrically isolating, and naturally tacky. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut options. Ideal for CPUs, GPUs, and power electronics.
3.0W/mK Thermal Conductive Silicone Pad 0.5mm-5mm for LCD TV Heat Dissipation
TIF140-30-25E silicone pad offers 3.0W/mK thermal conductivity, soft compressibility, and natural tack. UL 94 V0 rated. Fills uneven gaps to enhance heat transfer and extend component life. Custom shapes and thicknesses available.
3.0W Thermal Conductive Pad Fiberglass Reinforced Gap Filler for Memory Modules 0.5-5.0mm
High thermal conductivity 3.0W/mK gap filler pad with fiberglass reinforcement for durability. Soft and compressible for low-stress assembly. RoHS compliant, UL94 V-0 rated. Custom thicknesses and die-cut shapes available. Ideal for memory modules, power supplies, and automotive electronics.
Thermal Gap Pad 1.5W 1mm Thick 27 Shore 00 Grey Silicone for Routers Heat Dissipation
Soft and compressible thermal gap pad with 1.5W/mK conductivity fills air gaps between heating elements and heat sinks. Naturally tacky, no adhesive needed. UL94 V-0 rated. Custom thickness and die-cut shapes available. Enhances electronic component efficiency and lifespan.
2W/mK Thermal Conductive Silicone Pad 35 Shore 00 2.7 g/cm³ for Smartphone Heat Dissipation
TIF100-20-10E thermal pad offers 2.0W/mK conductivity, soft 35 Shore 00 hardness, and natural tack. Ideal for CPUs, LEDs, and portable electronics. UL V-0 rated, custom shapes available.
Gray Silicone Thermal Gap Filler 5.0 W/mK 0.254mm to 5.080mm
TIF 800 Series thermally conductive gap filler with 5.0 W/mK conductivity. Naturally tacky, soft, and compressible for low-stress applications. Available in thicknesses from 0.254mm to 5.080mm. UL 94 V0 rated. Ideal for LED, telecom, automotive, and semiconductor cooling.
7W/mK Thermal Conductive Silicone Pad 0.5-5mm Gray for CPU GPU VGA LED Heat Sink
High thermal conductivity 7W/mK silicone pad fills air gaps between heat sources and sinks. Flexible, self-adhesive, UL94 V-0 rated. Available in 0.5-5mm thicknesses and custom die-cut shapes. RoHS compliant. Ideal for CPUs, GPUs, power supplies, and automotive electronics.