Thermal Conductive Pad

Ziitek TIF120-05S thermal silicone pad offers 1.5W/mK conductivity, high insulation, and heat resistance. Available in 0.25-5.08mm thicknesses with customizable shapes, adhesive options, and RoHS compliance. Ideal for LED power supplies and IT infrastructure.

TIF140-20-18S thermal pad offers 2.0W/mK conductivity, UL94 V-0 flame rating, and soft compressibility for low-stress thermal management. Ideal for CPUs, LEDs, and PCBs. Custom thicknesses from 0.5mm to 5.0mm available. RoHS compliant.

High-performance thermal conductive pad with 1.5W/mK conductivity and 1500-5500VAC dielectric strength. Designed for LED lighting, telecommunication, and automotive applications. Features UL 94 V-0 rating, natural tackiness, and available in thicknesses from 0.25mm to 5.08mm. Provides reliable cooling and electrical isolation for electronic components.

TIF 140-20-18 series thermal gap filler pad with 2.0W/mK conductivity, 45 Shore 00 hardness, and 0.5-5.0mm thickness. Naturally tacky, soft, compressible, and RoHS compliant. Ideal for IGBTs, LED power supplies, and automotive electronics. Custom die-cut and adhesive options available.

TIF180-02F series silicone pad offers 1.5 W/mK thermal conductivity, soft compressibility, and natural tack. Available in 0.5mm to 5.0mm thickness with custom die-cut options. UL 94 V0 rated, ISO certified. Ideal for CPUs, GPUs, and power electronics.

Ultra-soft ceramic-filled silicone thermal pad with 2.0W/mK conductivity. Naturally tacky, UL 94 V0 rated, and RoHS compliant. Ideal for motherboards, power supplies, and automotive electronics. Custom thicknesses and adhesive options available.

TIF140FG-05S thermal pad offers 1.5W/mK conductivity, 0.5mm thickness, and fiberglass reinforcement. Soft, compressible, naturally tacky, UL recognized, RoHS compliant. Ideal for CPUs, LEDs, and ultra-thin devices.

TIF140-20-02S is a ceramic filled silicone elastomer pad with 2.0W/mK thermal conductivity and UL94 V0 flame rating. Soft, compressible, and naturally tacky for low-stress assembly. Ideal for automotive ECUs, LED lighting, and telecom hardware. Custom thickness and adhesive options available.

Ultra-soft ceramic-filled silicone thermal pad with 1.5W/mK conductivity. Low assembly stress, high conformability. UL recognized, RoHS compliant. Custom thicknesses from 0.5mm to 5mm. Ideal for CPU, GPU, and power electronics.

High-performance silicone thermal conductive pad with 5.0W/mK thermal conductivity and 40 Shore 00 hardness. Electrically isolating material suitable for CPU, GPU, and electronics cooling applications. UL94 V-0, SGS, and ROHS compliant. Available in thicknesses from 0.25mm to 5.08mm for various thermal management needs.

TIF160-02F series thermally conductive pad with 1.5 W/mK conductivity, soft and compressible for low stress applications. Fills air gaps between heating elements and heat sinks, enhancing efficiency and lifetime. UL 94 V0 rated, customizable thickness and adhesive options.

TIF120-02F series ultra soft thermal gap pad with 1.5 W/mK conductivity, 60 Shore 00 hardness, and >5500 VAC dielectric strength. Naturally tacky, RoHS compliant, available in 0.254–5.080 mm thickness. Ideal for CPUs, power supplies, and automotive electronics.

TIF®140-20-11E thermal pad offers 2 W/mK conductivity, self-adhesive design, and good softness for effective heat transfer. UL94 V-0 certified, available in custom shapes and thicknesses. Ideal for CPUs, LEDs, power modules, and automotive ECUs.

TIF140-30-02S is a 3W/mK ceramic-filled silicone thermal pad with natural tack, soft compressibility, and thickness options from 0.25mm to 5.08mm. Ideal for gap filling, insulation, and damping in wireless routers and electronics. UL 94 V0 rated, ISO certified, with custom die-cut and adhesive options.

TIF180-20-16E series thermal pad with 2.0 W/mK conductivity, high tack surface, and wide temperature range. Soft, compressible, UL recognized, RoHS compliant. Ideal for CPUs, LEDs, and PCBs. Custom thicknesses available.

TIF 100-10S silicone gap pad offers 1.5 W/mK thermal conductivity, low hardness, and electrical isolation. Ideal for LED controllers, automotive, and telecom. UL V-0 rated, customizable thickness, and available with adhesive options.

Soft, compressible silicone gap pad with 2.0W/mK thermal conductivity. UL94 V-0 rated, electrically isolating, and naturally tacky. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut options. Ideal for CPUs, GPUs, and power electronics.

TIF140-30-25E silicone pad offers 3.0W/mK thermal conductivity, soft compressibility, and natural tack. UL 94 V0 rated. Fills uneven gaps to enhance heat transfer and extend component life. Custom shapes and thicknesses available.

High thermal conductivity 3.0W/mK gap filler pad with fiberglass reinforcement for durability. Soft and compressible for low-stress assembly. RoHS compliant, UL94 V-0 rated. Custom thicknesses and die-cut shapes available. Ideal for memory modules, power supplies, and automotive electronics.

Soft and compressible thermal gap pad with 1.5W/mK conductivity fills air gaps between heating elements and heat sinks. Naturally tacky, no adhesive needed. UL94 V-0 rated. Custom thickness and die-cut shapes available. Enhances electronic component efficiency and lifespan.