Thermal Conductive Gel

TIF®035-05 thermally conductive putty delivers 3.5W/mK thermal conductivity with low compression and 0.08°C·in²/W thermal impedance. This silicone gel-based gap filler prevents filler migration, operates from -45°C to 200°C, and carries UL 94 V-0 flame rating. Ideal for vehicle engine controllers, LED lighting, and high-power electronics.

High-performance silicone thermal gap filler with 5.0 W/mK conductivity and -45°C to 200°C operating range. Features UL 94 V-0 flame rating, low thermal impedance, and automated dispensing compatibility. Ideal for LED modules, heat-sinks, telecom equipment, and high-power electronics requiring reliable thermal management solutions.

High-performance thermal conductive gel with 4.5W/mK thermal conductivity and UL 94 V-0 rating. This silicone-based gap filler provides superior heat dissipation for microprocessors, LED lighting, and high-power electronic components. Features low thermal impedance, automated dispensing compatibility, and proven reliability for industrial applications.

TIF015-07 thermal conductive gel provides 1.5W/mK thermal conductivity with superior compressibility for electronic cooling applications. Features UL 94V0 flame rating, -45°C to 200°C operating range, and compatibility with automated dispensing systems. Ideal for BGA packages, LED lighting, and high-power components requiring efficient thermal management.

TIF®030-05 blue thermal gap filler offers 3.0 W/mK conductivity with high viscosity to prevent filler separation. Features UL 94 V-0 flame rating, -45°C to 200°C operating range, and compatibility with automated dispensing. Ideal for microprocessors, LED lighting, telecom equipment, and micro heat pipe applications with proven long-term reliability.

High-performance silicone thermal gel with 6.0 W/mK conductivity and V-0 flame rating. Designed for LED lighting, microprocessors, and high-power electronics. Features low thermal impedance, automated application compatibility, and operates from -45°C to 200°C. ISO9001, IATF16949, and UL certified for reliable thermal management solutions.

TIF020-19 thermal gel offers 2.0 W/mK conductivity with UL94 V-0 rating and 4000 V/mm dielectric strength. This silicone-based gap filler prevents filler migration, operates from -45°C to 200°C, and is ideal for LED lighting, microprocessors, and telecom equipment. Available in 30cc and 300cc packaging options with custom configurations.

High-performance two-component thermal conductive gel with 5.0W/mK thermal conductivity, UL recognized certification, and 1:1 mix ratio. Ideal for CPU, PC, and GPU cooling applications in notebooks, set-top boxes, and power systems. Features 6-month shelf life, 200°C operating temperature, and available in 50cc and 400cc packaging options.

TIF080 AB-11S is a high thermal conductive 8.0W/mK two-component silicone gel for efficient heat transfer. Features UL94 V-0, excellent stability, and customizable thickness. Ideal for computers, automotive electronics, and telecommunications.

Ziitek TIF040AB-12S thermal conductive putty delivers 4.0W/mK thermal performance with UL recognition and natural tackiness. This two-component silicone material offers easy dispensing, 45 shore 00 hardness, and operates from -45°C to 200°C. Ideal for notebooks, set-top boxes, and power systems requiring efficient heat dissipation.

High-performance thermal conductivity gel with 3.5W/mK efficiency, UL certification, and flexible curing options. Ideal for notebooks, set-top boxes, power systems, and semiconductor cooling. Features 200,000 cps viscosity, -45°C to 200°C temperature range, and 94V0 flame rating for reliable thermal management solutions.

Professional two-component thermal conductive gel with 3.0W/mK thermal conductivity for memory chips and electronic components. Features UL94V0 flame rating, -45 to 200℃ operating range, and easy dispensing for efficient heat transfer in computers, telecommunications, and automotive applications.

High-performance thermal conductive putty with 2.0W/mK thermal conductivity and UL 94V0 flame rating. Features two-component formulation, 550,000 cps viscosity, and wide -45°C to 200°C operating range. Ideal for notebook computers, power supplies, and semiconductor heat dissipation applications.

High-performance thermal conductive putty with 1.5W/mK thermal conductivity for efficient heat management in electronic devices. Features UL recognition, two-part formulation, and custom packaging options. Ideal for tablets, notebooks, and high-speed storage drives requiring reliable thermal solutions.

TIF080-11 silicone gel offers 8.0W/mK thermal conductivity, ultra-soft compression, and low thermal impedance. Ideal for automated dispensing, it prevents filler migration and ensures long-term reliability. UL94 V-0, RoHS compliant. Custom packaging available.

Ziitek TIF050-11-1 thermal gap filler gel offers 5.0W/mK conductivity, low stress, and strong plasticity. Ideal for power modules, LED lighting, and telecom. UL94 V-0 rated, electrically isolating, and available in custom packaging.

TIF 040-12 is a soft silicone gel gap filler with 4.0 W/mK thermal conductivity. It offers low thermal impedance, high viscosity to prevent filler migration, and long-term reliability. Ideal for micro heat pipes, LEDs, and high-power electronics. Custom packaging available for automation.

High-performance silicone thermal gel with 9.0W/mK conductivity and low thermal impedance. Ideal for vehicle engine controllers and high-power electronics. UL94 V-0, RoHS compliant. Custom syringe packaging available for automated dispensing.

High-performance thermal conductive gel featuring 1.5W/mK thermal conductivity and ceramic-filled silicone composition. Ideal for CPU, GPU, and electronic component cooling with automated application compatibility, 94V0 flame rating, and proven long-term reliability in demanding thermal management applications.

Premium silicone thermal gap filler with 1.5W/mK conductivity and -45°C to 200°C operating range. Features ceramic-filled silicon composition, 94V0 flame rating, and compatibility with automated dispensing systems. Ideal for microprocessors, BGA packages, and high-power electronic components requiring efficient heat dissipation.