Phase Changing Materials

TIC 800G series phase change thermal interface materials offer 5.0 W/mK conductivity with low 0.014°C-in²/W thermal resistance. Features include 50°C softening temperature, natural tackiness without adhesive, and reliable performance from -25°C to 125°C. Ideal for electronics cooling applications including microprocessors, servers, and LED lighting systems.

TIC™808A phase change thermal interface material offers 2.5 W/mK thermal conductivity and 0.018℃-in²/W thermal resistance. Features include no heat sink preheating, natural tackiness without adhesive, and stable performance through 1,000 hours at 130℃. Ideal for high-frequency microprocessors, cache chips, and server applications with standard thicknesses from 0.003" to 0.010".

Ziitek TIC 800K Series phase change material provides 1.8W thermal conductivity for efficient CPU and GPU cooling. Features ceramic-filled compound on Kapton film, low thermal resistance, RoHS compliance, and custom die-cut options. Ideal for microprocessors, servers, memory modules, and LED applications with continuous use from -50°C to 130°C.

High-performance thermal interface pads with 0.95 W/mK conductivity and 0.024℃-in²/W thermal resistance. Designed for microprocessors, PCs, and servers with operating range -25°C to 125°C. Naturally tacky, no adhesive required, and no heat sink preheating needed for reliable thermal management solutions.

High-performance thermal interface material with 0.95W/mK conductivity and 0.024°C-in²/W thermal resistance. Features natural tackiness, no adhesive requirement, and maintains performance through 1,000 hours at 130°C or 500 thermal cycles. Ideal for microprocessors, servers, LED systems, and power electronics.

Ziitek TIC800G phase change thermal interface material offers 5.0W/m·K conductivity with phase transition at 50-60℃. Ultra-thin 0.126-0.305mm sheets provide superior heat absorption and lower thermal impedance than traditional grease. Ideal for microprocessors, servers, and PC cooling applications with UL94 V-0, SGS, and ROHS compliance.

TIC™800G series phase change thermal interface materials provide superior thermal management for IGBTs and high-performance electronics. Features include 5.0 W/mK thermal conductivity, 0.014℃-in²/W thermal resistance, and natural tackiness without adhesives. Available in 0.127mm to 0.305mm thicknesses with UL94 V-0, SGS and ROHS compliance.

ZIITEK TIC800P series is a high-performance phase change material with 0.95 W/mK thermal conductivity. It softens at 50°C to fill surface gaps, reducing thermal resistance. Features low thermal impedance, no adhesive required, and reliability after 1000 hours at 130°C. Ideal for IGBTs and CPUs.

TIC 810P series phase change thermal interface pad softens at 50°C to fill surface gaps, reducing thermal resistance to 0.024°C-in²/W. No adhesive or preheating needed. Reliable after 1000 hours at 130°C. Ideal for LEDs, IGBTs, and CPUs.

TIC™805P Series phase change material pad with low thermal resistance of 0.024°C-in²/W. Softens at 50°C to fill gaps, no adhesive needed. Reliable after 1000h at 130°C. Ideal for IGBTs, CPUs, and LED power supplies.

High-performance phase change thermal interface material with 2.5 W/mK conductivity. Self-adhesive, low thermal resistance, and RoHS approved. Ideal for power electronics, LEDs, and laptops. Custom thicknesses and die-cutting available.

High-performance phase change thermal interface material with 2.5 W/mK thermal conductivity and 50°C phase transition temperature. Features low thermal resistance, self-adhesive properties, and compatibility with low-pressure applications. Ideal for power conversion, communication hardware, LED systems, and laptop computers. Available in multiple thicknesses from 0.005" to 0.020" with custom die-cutting options.

Low melting point thermal interface material with 0.024℃-in²/W thermal resistance and 0.95 W/mK conductivity. Phase changes at 50℃ to fill surface irregularities, eliminating need for adhesives or preheating. Ideal for microprocessors, PCs, servers, and telecom equipment with excellent thermal stability.

TIC™808P series phase change thermal interface materials offer 0.95 W/mK thermal conductivity and 0.014℃-in²/W thermal resistance for superior heat transfer. These pink thermal pads feature natural tackiness, require no adhesive, and maintain performance through 1,000 hours at 130°C. Ideal for IGBTs, microprocessors, and server applications.

High-performance phase change thermal interface material with 2.5 W/mK thermal conductivity and 50°C phase transition temperature. Features low thermal resistance, self-adhesive properties, and compatibility with power conversion equipment, LED systems, and computing devices. Available in multiple thicknesses from 0.005" to 0.020" for various thermal management applications.

Gray thermal interface material with phase change technology for high-power LED lighting applications. Features 5.0 W/mK thermal conductivity, 0.014°C-in²/W thermal resistance, and operating range from -25℃ to 125℃. No adhesive required, naturally tacky at room temperature, and maintains performance through 500 thermal cycles and 1,000 hours at 130℃.

TIC™808P Series thermal interface material offers 0.95 W/mK conductivity and 0.024℃-in²/W thermal resistance without preheating requirements. This pink phase change material operates from -25℃ to 125℃, provides natural tackiness at room temperature, and maintains performance through 1,000 hours at 130℃. Ideal for microprocessors, notebooks, servers, and memory modules.

High-performance thermal interface material with 2.5W/mK conductivity and 50°C phase change temperature. Features low thermal resistance, self-adhesive properties, and compatibility with low-pressure applications. Ideal for power conversion, communication hardware, LED systems, and laptop computers. Available in multiple thicknesses from 0.005" to 0.020" with custom die-cutting options.

TIC812G phase change thermal interface material offers ultra-low 0.014℃-in²/W thermal resistance with 5.0 W/mK conductivity. Features 50℃ softening temperature, no adhesive requirement, and stable performance through 1,000 hours at 130°C. Ideal for microprocessors, servers, and memory modules with customizable thickness options from 0.005" to 0.012".

TIC™810Y series thermal interface material softens at 50°C to fill surface gaps, reducing thermal resistance to 0.024°C-in²/W. Naturally tacky, no adhesive or preheating needed. Reliable after 1000h at 130°C. Ideal for LED power supplies, IGBTs, and CPUs. Custom sizes available.