Thermal Gap Filler

High-performance thermal gap filler with 2.0 W/m-K conductivity, naturally tacky surface, and excellent compressibility. Ideal for LED TV cooling, automotive electronics, and telecommunications hardware. Available in thicknesses from 0.25mm to 5.08mm with UL 94 V0 fire rating and multiple industry certifications.

High-performance thermal gap filler with 6 W/mK conductivity for efficient heat dissipation in electronic applications. Features natural tackiness, 50 Shore 00 hardness, UL 94 V-0 rating, and operating range from -50°C to 200°C. Ideal for LED lighting, automotive systems, telecommunications, and portable electronics cooling solutions.

High-performance thermal interface material with 13.0W/mK conductivity and UL94 V-0 flame rating. Designed for wireless routers, automotive electronics, and LED systems. Available in standard 16x16 inch sheets with thickness options from 0.75mm to 5.0mm. ISO and IATF16949 certified manufacturer.

High-performance thermal interface material with 3.0 W/mK conductivity for efficient heat dissipation in LED applications. Features natural tackiness, soft compressible design, UL94 V-0 flame rating, and available in thicknesses from 0.25mm to 5.08mm. Ideal for automotive electronics, telecommunications, and portable devices with comprehensive quality certifications.

2 W/m-K Silicone Rubber Thermal Gap Filler For Automotive Engine Control Units45 Shore 00 TIF100-20-02s Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production,

Good performance Thermal Gap Filler TIF™150-19S Ceramic Filled Silicone PAD , 55 Shore 00 Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us

High-performance thermal interface pad with 1.6 W/mK conductivity, naturally tacky surface, and UL 94 V0 fire rating. Available in thicknesses from 0.25mm to 5.08mm for LED lighting, power adapters, and electronic cooling applications. Features ceramic-filled silicone construction with temperature range -40°C to 160°C and customizable adhesive options.

Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling Product Overview The TIF® 100-16-38UF is an electrically insulating, thermally conductive interface material designed to fill air gaps between heating elements and heat dissipation components. This material is ideal for applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. Key Features Excellent thermal conductivity:

Ultra thin blue silicone pad 1.5W/mK TIF130-05S thermal gap filler 2.10 g/cc 55 Shore 00 for LED lighting Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others. The TIF130-05S use

Violet Thermal Conductivity Materials thermal gap filler 1.5 W/M-K For Micro Heat Pipe Thermal Solutions Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating

High-performance thermal interface material with 5.0 W/mK conductivity and 45 Shore 00 hardness. Blue ceramic-filled silicone rubber pad provides excellent heat transfer, insulation, and sealing for telecommunication hardware, automotive electronics, and LED applications. Available in multiple thicknesses with UL 94 V0 fire rating and customizable options.

Blue 5.0 W/mK Ultra Soft Thermal Gap Filler With Adhesive Coating Silicone Rubber Sheet For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully

High Thermally Conductive Filler Pads TIF840QE LED Light Application 1mm Thickness The TIF840QE thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances

2.8W thermal conductivity thermal gap filler pad for LED light heat sinking The TIF310FG thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the

2.5mm thickness China supplier thermal gap filler pads for LED-lit BLU in LCD Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable

Good thermal performance violet 2.0W/mK thermal gap filler for Automotive engine control units Company ProfileZiitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. The TIF100-20-16S Ziitek thermal conductive interface materials are widely recognized and trusted by users and can meet

Garnet silicone Thermal gap filler Heatsink Thermal Pad 6.0 W/MK The TIF600P Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. Features: > Good thermal conductive:6.0 W/mK > Naturally tacky needing no further adhesive coating

Soft Compressible Violet 4W Thermal Gap Filler 50 shore00 apply for High speed mass storage drives The TIF™100-40-16S Series is an extremely soft gap filling material rated at a thermal conductivity of 4.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek TIF™100-40-16S (产品型号) is

Soft, compressible thermal silicone pads with 1.5 W/mK conductivity for efficient heat transfer in electronic devices. Features natural tackiness, RoHS compliance, UL recognition, and fire rating 94 V0. Available in thicknesses from 0.51mm to 5.08mm for CPU, GPU, SSD, LED, and automotive applications.

Blue Color Thermal Gap Filler , 3W / MK Silicone Gap Pad For Telecom Device The TIF520S-FG thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the