Thermal Gap Filler

TIF™100 Series thermal gap filler provides 1.5W/mK conductivity for automotive engine control units and electronics. Features natural tackiness, compressible design, and UL 94V-0 fire rating. Available in thicknesses from 0.25mm to 5.08mm with optional adhesive and reinforcement options for enhanced thermal management.

TIF100-19U is a soft, compressible ceramic filled silicone gap pad with 1.5 W/mK thermal conductivity and 25 Shore 00 hardness. It offers natural tack, electrical isolation, and UL94 V-0 compliance. Ideal for LED, automotive, and telecom cooling. Custom thicknesses and adhesive options available.

High-performance silicone gap pad with 3.2 W/mK thermal conductivity and UL94 V-0 flame rating. Soft, compressible, and electrically isolating for low-stress thermal management. Available in custom shapes and thicknesses from 0.25mm to 5.00mm. Ideal for LED, automotive, telecom, and semiconductor applications.

Ultra soft silicone thermal gap filler with 3.0 W/m-K conductivity and 55 Shore 00 hardness. Naturally tacky, compressible, and RoHS compliant. Ideal for LED controllers, automotive, and telecom. Available in 0.25mm to 5.08mm thicknesses. UL94 V0 rated.

Electrically isolating thermal gap filler with 3.0W/mK conductivity. Soft, compressible, and naturally tacky for low-stress applications. Operates from -50 to 200°C. Ideal for LED TV, automotive, and telecom hardware. Custom thickness and adhesive options available.

High-performance thermal gap filler with 2.0 W/m-K conductivity, naturally tacky surface, and excellent compressibility. Ideal for LED TV cooling, automotive electronics, and telecommunications hardware. Available in thicknesses from 0.25mm to 5.08mm with UL 94 V0 fire rating and multiple industry certifications.

High-performance thermal interface material with 13.0W/mK conductivity and UL94 V-0 flame rating. Designed for wireless routers, automotive electronics, and LED systems. Available in standard 16x16 inch sheets with thickness options from 0.75mm to 5.0mm. ISO and IATF16949 certified manufacturer.

High-performance thermal gap filler with 6 W/mK conductivity for efficient heat dissipation in electronic applications. Features natural tackiness, 50 Shore 00 hardness, UL 94 V-0 rating, and operating range from -50°C to 200°C. Ideal for LED lighting, automotive systems, telecommunications, and portable electronics cooling solutions.

High-performance thermal interface material with 3.0 W/mK conductivity for efficient heat dissipation in LED applications. Features natural tackiness, soft compressible design, UL94 V-0 flame rating, and available in thicknesses from 0.25mm to 5.08mm. Ideal for automotive electronics, telecommunications, and portable devices with comprehensive quality certifications.

High-performance thermal conductive pad with 13.0W/mK conductivity, naturally tacky, and high compliance. Fills irregular gaps between components and heat sinks. UL94 V-0 rated, available in custom shapes and thicknesses from 0.75mm to 5.0mm. Ideal for telecom, automotive, and LED applications.

High performance 1.5mm thermal gap filler pad with 2.0 W/mK conductivity. Naturally tacky, low thermal resistance, and UL94 V-0 rated. Ideal for LED, automotive, and telecom applications. Custom thickness and die-cut options available.

High-performance thermal interface pad with 1.6 W/mK conductivity, naturally tacky surface, and UL 94 V0 fire rating. Available in thicknesses from 0.25mm to 5.08mm for LED lighting, power adapters, and electronic cooling applications. Features ceramic-filled silicone construction with temperature range -40°C to 160°C and customizable adhesive options.

TIF840QE thermally conductive filler pads efficiently fill air gaps between heating elements and heat sinks. With 13.0W/mK thermal conductivity, 1mm thickness, and natural tack, they enhance heat dissipation and component lifespan. Ideal for LED lighting, automotive electronics, and telecom equipment. UL94 V-0 compliant.

TIF410FG thermal gap filler fills air gaps between heating elements and heat sinks. With 2.0 W/mK conductivity, fiberglass reinforcement, and 0.25mm thinness, it enhances heat transfer and component lifespan. UL 94 V-0 rated, customizable thickness and adhesive options available.

TIF4120 ultra soft thermal gap filler fills air gaps between heating elements and heat sinks. Features 2 W/mK thermal conductivity, 3 mm thickness, and ceramic filled silicone rubber. Offers custom shapes, adhesive options, and UL 94 V0 fire rating. Ideal for telecom, automotive, and IT hardware.

TIF4100 is a ceramic-filled silicone thermal gap filler with 2.0 W/mK conductivity and 2.5mm thickness. Flexible, durable, and cost-effective for uneven surfaces. UL94 V0 rated. Custom sizes and adhesive options available. Ideal for LED, telecom, and automotive electronics.

Ziitek TIF4120 is a 3mm thick, 2W/mK thermal gap filler pad with low hardness and natural tack. Ideal for heat sinking in LED-lit BLU LCDs. Soft, compressible, electrically isolating, and UL 94 V0 rated. Custom die-cut and adhesive options available.

High-performance thermal silicone pad with 2.0W/mK conductivity, low thermal resistance, and high softness. UL94V0 rated, operates from -40°C to 160°C. Ideal for motherboards, LEDs, and power electronics. Custom thickness and adhesive options available.

Ultra soft and naturally tacky thermal gap filler with 2.0 W/mK conductivity. Compressible for low-stress applications, UL94 V-0 rated, and available in thicknesses from 0.25mm to 5.08mm. Ideal for LED, automotive, and semiconductor cooling. Custom options available.

Soft, compressible thermal pad with 1.5 W/m-K conductivity and 45 Shore 00 hardness. Naturally tacky, electrically isolating, and RoHS compliant. Available in 0.25–5.08 mm thicknesses with custom adhesive options.