Thermal Conductive Pad

High-performance thermal conductive silicone pad with 1.5W/mK conductivity and 0.5-5.0mm thickness range. Features excellent vibration dampening, electrical isolation, and UL 94 V0 flame rating. Ideal for automotive battery systems, LED lighting, and electronic cooling applications with ISO9001 and IATF16949 certifications.

High-performance blue silicone thermal gap filler with 4 W/mK conductivity and 35 Shore 00 hardness. UL recognized, fiberglass reinforced for durability, and 94 V0 fire rated. Ideal for LED street lamps, automotive electronics, IT infrastructure, and portable devices. Available in thicknesses from 0.25mm to 5.08mm with pressure sensitive adhesive options.

High-performance blue thermal silicone pad with 3.2 W/mK conductivity and 35 Shore 00 hardness. Features natural tackiness, UL94V0 fire rating, and wide temperature range (-40°C to 160°C). Ideal for handheld electronics, LED systems, automotive controls, and telecommunications hardware. Available in multiple thicknesses with adhesive options.

High-performance silicone thermal gap filler with 4W/mK conductivity, UL94 V0 fire rating, and temperature range from -50°C to 200°C. Ideal for LED lighting, automotive electronics, telecommunications, and portable devices. Available in multiple thicknesses from 0.25mm to 5.08mm with custom die-cut shapes and adhesive options.

Ultra-soft silicone thermal pad with 3.0W/mK thermal conductivity and 27 Shore 00 hardness. Features natural tackiness, excellent vibration dampening, and electrical isolation. Ideal for WiFi modules, LED systems, automotive electronics, and portable devices. Available in thicknesses from 0.5mm to 5.0mm with UL 94 V-0 fire rating and custom die-cut options available.

High-performance silicone thermal gap filler with 1.5 W/mK conductivity and UL 94 V0 fire rating. Features fiberglass reinforcement, electrical isolation, and operates from -50 to 200°C. Ideal for power supplies, automotive electronics, and IT infrastructure with customizable thickness and adhesive options.

High-performance thermal conductive silicone pad with 2.0 W/mK conductivity and excellent surface tackiness. UL94 V0 certified, operates from -40℃ to 160℃, ideal for LED lighting, automotive electronics, and telecommunications. Available in thicknesses from 0.25mm to 5.08mm with pressure-sensitive adhesive options.

High-performance silicone thermal conductive pad with 2W/mK thermal conductivity and natural surface tackiness. Features 35 Shore hardness for optimal conformability, 94 V-0 fire rating, and available in thicknesses from 0.25mm to 5.08mm. Ideal for LED modules, power supplies, and electronic cooling applications requiring efficient heat dissipation and electrical insulation.

High-performance ceramic filled silicone thermal pad with 5 W/mK conductivity and 25 Shore 00 hardness. Features fiberglass reinforcement, UL 94 V0 fire rating, and excellent conformability for CPU, memory modules, and automotive applications. RoHS compliant with custom die-cut options available.

Professional-grade thermal conductive silicone pad with 1.5 W/mK thermal conductivity, designed for memory modules and electronic cooling applications. Features 45 Shore 00 hardness, -40 to 160°C operating range, and UL94 V-0 fire rating. Available in 20 standard thicknesses from 0.25mm to 5.08mm with RoHS compliance and custom die-cut options.

TIF140-20-02S is a ceramic filled silicone elastomer pad with 2.0W/mK thermal conductivity and UL94 V0 flame rating. Soft, compressible, and naturally tacky for low-stress assembly. Ideal for automotive ECUs, LED lighting, and telecom hardware. Custom thickness and adhesive options available.

TIF140-30-02S is a 3W/mK ceramic-filled silicone thermal pad with natural tack, soft compressibility, and thickness options from 0.25mm to 5.08mm. Ideal for gap filling, insulation, and damping in wireless routers and electronics. UL 94 V0 rated, ISO certified, with custom die-cut and adhesive options.

Soft, compressible silicone gap pad with 2.0W/mK thermal conductivity. UL94 V-0 rated, electrically isolating, and naturally tacky. Available in thicknesses from 0.5mm to 5.0mm with custom die-cut options. Ideal for CPUs, GPUs, and power electronics.

TIF140-30-25E silicone pad offers 3.0W/mK thermal conductivity, soft compressibility, and natural tack. UL 94 V0 rated. Fills uneven gaps to enhance heat transfer and extend component life. Custom shapes and thicknesses available.

TIF160-02F series thermally conductive pad with 1.5 W/mK conductivity, soft and compressible for low stress applications. Fills air gaps between heating elements and heat sinks, enhancing efficiency and lifetime. UL 94 V0 rated, customizable thickness and adhesive options.

High thermal conductivity 3.0W/mK gap filler pad with fiberglass reinforcement for durability. Soft and compressible for low-stress assembly. RoHS compliant, UL94 V-0 rated. Custom thicknesses and die-cut shapes available. Ideal for memory modules, power supplies, and automotive electronics.

Soft and compressible thermal gap pad with 1.5W/mK conductivity fills air gaps between heating elements and heat sinks. Naturally tacky, no adhesive needed. UL94 V-0 rated. Custom thickness and die-cut shapes available. Enhances electronic component efficiency and lifespan.

TIF100-20-10E thermal pad offers 2.0W/mK conductivity, soft 35 Shore 00 hardness, and natural tack. Ideal for CPUs, LEDs, and portable electronics. UL V-0 rated, custom shapes available.

TIF 800 Series thermally conductive gap filler with 5.0 W/mK conductivity. Naturally tacky, soft, and compressible for low-stress applications. Available in thicknesses from 0.254mm to 5.080mm. UL 94 V0 rated. Ideal for LED, telecom, automotive, and semiconductor cooling.

High thermal conductivity 7W/mK silicone pad fills air gaps between heat sources and sinks. Flexible, self-adhesive, UL94 V-0 rated. Available in 0.5-5mm thicknesses and custom die-cut shapes. RoHS compliant. Ideal for CPUs, GPUs, power supplies, and automotive electronics.