Thermal Gap Pad

UL recognized thermally conductive silicone rubber pad with 3.0 W/mK thermal conductivity and 4.0mm thickness. Electrically isolating, high durability, and low-stress vibration dampening. Ideal for power supplies, LED modules, and telecom hardware. Custom sizes available.

TIF5140-30-11US silicone sheet offers 3.0 W/mK thermal conductivity and 3.5mm thickness. Soft, compressible, and naturally tacky for low-stress applications. Ideal for notebooks, LED lighting, and power supplies. UL 94 V0 rated, RoHS compliant, with custom die-cut options available.

High-performance thermal silicone pad with 3.0 W/mK conductivity and 3.0mm thickness. UL94V0 rated, low oil permeability, and high compliance. Ideal for micro heat pipes, automotive ECUs, and LED controllers. Custom sizes available.

TIF5100-30-11US series gap filler offers 3.0 W/mK thermal conductivity and electrical isolation. Fiberglass reinforced for durability, UL recognized, and ideal for LED TV, lamps, and power supplies. Custom thickness options available.

High-performance thermal pad with 3.0 W/mK conductivity and 2.0mm thickness. Soft, compressible, low oil permeability, and UL94V0 rated. Ideal for LED ceiling lamps and waterproof power supplies. Custom thickness and adhesive options available.

TIF560-30-11US silicone gap pad offers 3.0 W/mK thermal conductivity, 1.5mm thickness, and low hardness for optimal conformability. Electrically isolating with fiberglass reinforcement, it ensures durability and easy handling for notebooks and power supplies. RoHS compliant.

Ultra soft 1.0mm thermal gap filler with 3.0 W/mK conductivity and 20 Shore 00 hardness. Naturally tacky, fiberglass reinforced, UL recognized and RoHS compliant. Ideal for telecommunication hardware and fragile components.

High-performance 0.5mm silicone thermal pad with 3.0 W/mK conductivity. Soft, compressible, and durable for gap filling in display cards. RoHS compliant, 20 Shore 00 hardness. Custom sizes and adhesive options available.

TIF500-30-11U thermal pad with 3.0W/mK conductivity fills air gaps for efficient heat transfer. Ultra soft, naturally tacky, and compressible for low-stress applications. Available in 0.25mm to 5.08mm thicknesses. UL 94 V0 rated. Ideal for LED, automotive, and telecom electronics.

High-performance 5 W/mK thermal pad fills air gaps between heat sources and sinks. Soft, compressible, and naturally tacky for easy installation. Ideal for LED lighting, automotive, and telecom. UL94 V-0 rated. Custom thicknesses and adhesive options available.

TIF500-30-11US series ceramic-filled silicone pad offers 3.0 W/mK thermal conductivity and natural tack for easy installation. Soft, compressible, and available in 0.25mm to 5.08mm thicknesses. UL 94 V0 rated, ideal for LEDs, telecom, and automotive electronics.

High-performance thermal pad with 5.0mm thickness, 2.0W/mK conductivity, and electrical isolation. Features low hardness (10 Shore 00), UL94 V-0 rating, and high durability. Ideal for RDRAM modules, LED lighting, and heat sink applications. Custom sizes available.

High-performance silicone thermal pad with 2.0 W/mK conductivity and easy release construction. UL recognized, RoHS compliant, and flame retardant. Ideal for CPUs, automotive ECUs, and portable electronics. Custom thickness options available.

TIF2160-20-02ES thermal pad offers 2.0W/mK conductivity, 4.0mm thickness, and UL94V0 rating. Low oil permeability, high softness, and stable -40°C to 160°C performance. Ideal for waterproof LED power and modules.

TIF2140-20-02ES silicone gap pad offers 2.0 W/mK thermal conductivity, low hardness 10 Shore 00, and electrical isolation. RoHS compliant, naturally tacky, and available in custom thicknesses. Ideal for LED power supplies and controllers.

TIF2120-20-02ES soft silicone pad offers 2.0 W/mK thermal conductivity and 10 Shore 00 hardness for minimal pressure on components. Provides excellent vibration dampening and electrical isolation. Ideal for automotive, IT, and consumer electronics. Custom sizes available.

High-performance thermal pad with 2.0 W/mK conductivity and >5000 VAC dielectric strength. Fills gaps, insulates, and dampens for ultra-thin notebook designs. RoHS compliant, UL 94 V0 rated, and available in custom sizes.

High-performance thermal pad with 2.0W/mK conductivity and 2.0mm thickness. Ceramic-filled silicone ensures low thermal resistance. UL94 V0 rated, 10 Shore 00 hardness. Ideal for RDRAM, LED, and heat sink applications. Custom sizes available.

High-performance thermal silicone pad with 2.0 W/mK conductivity, low thermal resistance, and high softness. Ideal for display cards, CPUs, and automotive ECUs. UL94 V-0 rated, operates from -40°C to 160°C. Custom thicknesses available.

Silicone-based thermal gap pad with 2.0 W/mK conductivity, 10 Shore 00 hardness, and moldability for complex parts. UL 94 V0 rated, electrically isolating, and ideal for LED bars, modules, and power supplies.