Thermal Gap Pad

High-performance thermal silicone pad with 1.5 W/mK conductivity and 1.9 g/cc density. Features high tack surface, low thermal resistance, and UL94 V0 rating. Ideal for CPUs, automotive ECUs, and telecom hardware. Custom thicknesses available.

Soft and compressible silicone pad with 1.5 W/m-K thermal conductivity and 0.5mm thickness. Low hardness (20 Shore 00) ensures conformability and low contact resistance. Electrically isolating, RoHS compliant, and ideal for LED modules, routers, and power supplies.

High-performance thermally conductive silicone gap pad with 1.8 W/mK conductivity, 5.0mm thickness, and 18 Shore 00 hardness. Electrically isolating, durable, and UL94 V-0 rated. Ideal for power supplies, LED lighting, and telecom hardware. Custom sizes available.

TIF1180-18-01US thermal gap pad offers 1.8 W/mK conductivity, 18 Shore 00 hardness, and fiberglass reinforcement for puncture resistance. Ideal for automotive electronics, it provides vibration dampening, electrical isolation, and RoHS compliance. Custom sizes available.

High-performance thermal gap pad with 1.8 W/mK conductivity, 4.0mm thickness, and UL 94 V0 fire rating. Fills gaps for efficient heat transfer, insulation, and damping. Ideal for set top boxes, power supplies, and LED controllers. RoHS compliant.

TIF1140-18-01US silicone thermal gap pad with 1.8 W/mK conductivity and 3.5mm thickness. UL 94 V0 rated, electrically isolating, low hardness for conformability. Ideal for LED power supplies, memory modules, and heat pipe solutions. RoHS compliant, custom sizes available.

Viscoelastic thermal gap pad, 3.0mm thick, 2.5g/cc density, 18 Shore 00 hardness. Offers 1.8 W/mK thermal conductivity, UL 94 V0 rated, fiberglass reinforced for durability. Ideal for LED power supplies and heat pipe solutions.

UL recognized thermal silicone pad with 1.8 W/mK conductivity, 2.5mm thickness, and 18 Shore 00 hardness. Low oil permeability, high softness, and stable from -40°C to 160°C. Ideal for power supplies, LED controllers, and audio video components. UL94 V0 rated.

UL recognized thermal gap pad with 1.8 W/mK conductivity, 2.5g/cc density, and 18 Shore 00 hardness. Low oil permeability, high softness, and stable from -40°C to 160°C. Ideal for audio video components and automotive electronics.

TIF160-18-01US thermal gap pad with 1.8 W/mK conductivity, UL 94 V0 rated. Soft, compressible silicone pad for low-stress heat dissipation in audio video components. Custom thickness and die-cut options available.

Silicone-based thermal gap pad with 1.8 W/mK conductivity, 1.0mm thickness, and 18 Shore 00 hardness. UL recognized, RoHS compliant, and fiberglass reinforced for durability. Ideal for audio video components, CPUs, and telecom hardware. Custom options available.

TIF120-18-01US thermal gap filler with 1.8 W/mK conductivity, UL 94 V0 rated. Soft, naturally tacky, electrically isolating. Ideal for LED, LCD, and power electronics. Custom sizes available.

Silicone-based thermal gap pad with 3.0 W/mK conductivity, 5.0mm thickness, and 20 Shore 00 hardness. Offers high tack, electrical isolation, and fiberglass reinforcement. Ideal for automotive ECUs, LED power supplies, and heat sinks. UL 94 V0 rated.

High-performance thermal pad with 3.0 W/mK conductivity, 4.5mm thickness, and 20±5 Shore 00 hardness. Electrically isolating, vibration dampening, and UL94 V0 rated. Ideal for automotive ECUs, telecom, and portable electronics. Custom sizes available.

Ultra-soft gap filler with 3.0 W/mK thermal conductivity and 20±5 Shore 00 hardness. Fiberglass reinforced for tear resistance, electrically isolating, and UL94 V-0 rated. Ideal for memory modules, automotive electronics, and power adapters. Custom thickness and adhesive options available.

High-performance silicone pad with 3.0 W/mK thermal conductivity, 94 V0 fire rating, and 3.0 g/cc density. Soft, compressible, and electrically insulating for micro heat pipe and ultra-thin device thermal management. UL recognized and RoHS compliant.

TIF1120-30-11US thermal pad offers 3.0 W/mK conductivity, 20±5 Shore 00 hardness, and fiberglass reinforcement. UL recognized, electrically isolating, and ideal for low-pressure semiconductor ATE applications.

Ultra-soft gap filler with 3.0 W/mK thermal conductivity, 2.5mm thickness, and UL 94 V0 rating. Ideal for low-stress assembly on CPUs, telecom hardware, and portable electronics. Offers excellent conformability and fiberglass reinforcement.

TIF180-30-11US is a soft, compressible gap pad with 3.0 W/mK thermal conductivity and 2.0mm thickness. Fiberglass reinforced for puncture resistance, it offers excellent wet-out on rough surfaces. UL 94 V0 rated, with custom sizes available. Ideal for IT infrastructure and power supplies.

High-performance 3.0 W/mK silicone thermal pad with 1.5mm thickness and 20±5 Shore 00 hardness. Fiberglass reinforced for durability. Ideal for audio, video, and automotive electronics. UL94 V0 rated. Custom sizes available.