Alumina Ceramic Parts

Polished Aluminum Nitride Substrate Features: 1. The surface undergoes high-precision grinding, resulting in high surface flatness, good smoothness, and low roughness. Dimensions: The standard size of the ground aluminum nitride substrate is 120mm x 120mm x 1mm, but customization is also available upon request. Applications: High-precision grinding processes for hard drive heads, solar cells, LED packaging, mechanical parts, and optical equipment. Features: It has high

Aluminum Nitride Substrate Product Advantages: 1. Standard thermal conductivity 175W/m·K, high thermal conductivity 200W/m·K, ultra-high thermal conductivity 230W/m·K. 2. Customization services available, capable of producing substrates such as milled type, ready-to-burn type, high bending resistance, high thermal conductivity, polished type, and laser-marked type. 3. Suitable for various metallization: DPC, DBC, TPC, AMB, thick film printing, thin film printing, etc. 4.

Aluminum Nitride Ceramic Aluminum nitride ceramics possess excellent thermal conductivity and electrical insulation properties, performing exceptionally well even in high-humidity environments. This makes them an ideal material for thermal management and electrical applications. Furthermore, the electrical insulation and thermal expansion coefficient of aluminum nitride are quite similar to those of silicon wafers, which is why it is frequently used in the chip manufacturing

Aluminum Nitride Structural Parts Itismadeofsel-developedaluminumnitridespraygranulationpowderafter dry pressing,isostatic pressing and other processes. Advantage: 1. Large AIN parts Max size: 450mm, Max thickness: 20mm. 2.Total in house manufactured. 3. Customized. Parameter: Project Unit Parameter Color - Gray/Beige Thermal conductivity [@20°C] W/m·k ≥170 Flexual strength MPa >350 Surface roughness μm 0.02-0.7 Warpage %0

Aluminum Nitride Structural Parts We uses tape casting process to produce substrates.We developed different subdivisions in order to meet different metallization requests for different applications. 1. The source quality is controlled. Froe R & D and production of raw materials to the finished ceramic products, they are self-developed and produced. 2. Standardthermal conductivity2 175W/mk, high thermal conductivity2 200W/mk, Ultra high thermal conductivity≥230W/m-k. 3. We can

We uses tape casting process to produce substrates.We developed different subdivisions in order to meet different metallization requests for different applications. 1. The source quality is controlled. Froe R & D and production of raw materials to the finished ceramic products, they are self-developed and produced. 2. Standardthermal conductivity2 175W/mk, high thermal conductivity2 200W/mk, Ultra high thermal conductivity≥230W/m-k. 3. We can provide grinding type, as-fired

Aluminum Nitride Structural Parts We uses tape casting process to produce substrates.We developed different subdivisions in order to meet different metallization requests for different applications. 1. The source quality is controlled. Froe R & D and production of raw materials to the finished ceramic products, they are self-developed and produced. 2. Standardthermal conductivity2 175W/mk, high thermal conductivity2 200W/mk, Ultra high thermal conductivity≥230W/m-k. 3. We can

High-Purity Alumina Crucible High-purity crucibles are essential components in high-temperature sintering and powder preparation processes. The high-purity alumina ceramic crucibles produced by our company are carefully crafted using high-quality raw materials and advanced manufacturing techniques, demonstrating excellent purity and corrosion resistance. They play a crucial role in various fields, including metal smelting, crystal growth, and ceramic sintering, ensuring the

AlN Metalization (HTCC) Aluminum nitride(High Temperature Co-Fired Ceramic) is a kind of ceramic substrate with high thermal conductivity and high density, whichis made by pre-designed circuit through punching,filling andprinting onthe AlN green type, and then laminated and sintered at high temperature. Advantage: ● First company with commercial AIN HTCC mass production capacity in China ● Independent R&D and manufacturing of core equipment: hightemperature refractory

Aluminum Nitride Structural Parts Itismadeofsel-developedaluminumnitridespraygranulationpowderafter dry pressing,isostatic pressing and other processes. Advantage: 1. Large AIN parts Max size: 450mm, Max thickness: 20mm. 2.Total in house manufactured. 3. Customized. Parameter: Project Unit Parameter Color - Gray/Beige Thermal conductivity [@20°C] W/m·k ≥170 Flexual strength MPa >350 Surface roughness μm 0.02-0.7 Warpage %0

Aluminum Nitride Granulation Powder High purity AIN powder for electronic materials is the optimal material choice for sintering AIN substrates. The sintered AIN substrate exhibits ultra-high thermal conductivity, excellent electrical insulation, and thermal expansion properties comparable to semiconductor materials such as silicon wafers. This makes it widely applicable in the electronic packaging industry. We utilize the carbothermal reduction method to produce high-purity

Aluminum Nitride Powder High purity AlN powder for electronic materials is the optimal material choice for sintering AIN substrates. The sintered AIN substrate features ultra-high thermal conductivity, excellent electrical insulation, and thermal expansion properties that closely match semiconductor materials such as silicon wafers. Widely used in the electronic packaging industry, our aluminum nitride powder is produced using the carbon thermal reduction method, ensuring

Yttria-Stabilized Zirconia Beads KY-600 KY-600 is a high-density, ultra-low-wear ceramic grinding medium engineered for high-speed, high-viscosity, and high-concentration processes in stirred mills and sand mills. Technical Specifications Property Unit Value True density g/cm³ 6.00-6.08 Bulk density g/cm³ 3.60-3.80 Vickers hardness (HV5) - ≥1200 Sphericity % >95 Size range mm 0.1-60 Main ingredients - ZrO₂+Y₂O₃+others Color - White Key Features Dense tetragonal-phase

Precision Ceramic Parts Semiconductor Wafer Handling Arm Aluminum Nitride (AlN) is the only technical ceramic material that features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. Properties and Advantage Very high thermal conductivity High electrical insulation capacity Low thermal expansion Good metalization capacity Forming Technology Dry Pressing Cold Isostatic Pressing Tape Casting Extrusion Related

Zirconia Ceramic Parts Technical papameters CZR92 Color White Density 6.0 Zirconia content 94.4% Gas permeability 0 Water Abscrption 0% Cystal Size 0.5 Rockwell Hardness 78 Vickers Hardness 11.5(1175) Flexural Strength 800 Compressive Strength 2000 Modulus of Elasticity >200 Fracture Thoughness 9.0 Thermal Conductivity 2.5 Thermal Expansion Coefficient 9.6 Thermal Shock Resistance 250 Quality control:

Transparent Alumina Ceramic Substrate With the continuous advancement of electronic technology, the demand for high-performance substrate materials keeps rising. Transparent alumina ceramic substrates have gradually become popular in the fields of semiconductor packaging and electronic circuits. ZG is the first domestic company to achieve mass production of 4/6/12-inch transparent alumina substrates. Its products are used in semiconductor packaging, and their quality is

Alumina Porous Ceramic Alumina porous ceramics are mainly made of special high-purity alumina and high-purity corundum, and they are made of ceramic products with high porosity according to the special particle proportion.It is mainly used in the chrome plating industry to remove impurities and reduce trivalent chromium, and to reduce trivalent chromium in plastic plating roughening solutions, debinding and burning of some fine ceramics, debinding of powder metallurgy

High Quality Alumina Ceramic Alumina ceramic is widely used in many fields.Because ofitsexcellent performance,it is more and more used in current society which meet need for daily using and special features. Quality control:

Transparent Alumina Ceramic Substrate Main Characteristic: ● Excellent transmittance across visible, infrared, and ultraviolet wavelengths. Surface treatment allows for near-glass optical performance while effectively suppressing light scattering, ensuring efficient light transmission. ● High insulation performance allows for high-frequency, high-voltage operation, maintaining stable electrical properties even at high temperatures. ● High flexural strength and impact

High-Purity Foam Alumina Ceramic Insulation Bricks, Furnace High-purity alumina foam ceramic is an advanced porous ceramic material with an alumina purity exceeding 99.5%. Its porosity can be customized to specific requirements, ranging from 50% to 80%. Produced through an advanced foaming process, our foam ceramic products possess a unique porous structure that not only provides excellent thermal insulation and filtration properties, but also boasts high strength, high