SiC Epitaxial Wafer

P-Level 2-Inch SiC Substrate 4H-N/SI260μm±25μm For Demanding Power Electronics JDCD03-001-001 2-inch SiC substrate P-level 4H-N/SI260μm±25μm for power devices and microwave devices Overview High crystal quality for demanding power electronics As transportation, energy and industrial markets evolve, demand for reliable, high performance power electronics continues to grow. To meet the needs for improved semiconductor performance, device manufacturers are looking to wide

4H SiC Epitaxial Wafer ≤0.2 /Cm2 0.015Ω•Cm—0.025Ω•Cm 150.0 mm +0mm/-0.2mm JDCD03-001-004 Overview The 200-mm wafers can be used for a variety of applications. These wafers are 50% thinner than the standard silicon wafer, so the 200-mm diameter can be used for more SiC devices. The 200-mm size is much more efficient and will allow more devices to be built on the same size. A 200-mm-diameter SiC is a very expensive semiconductor, but its high yield makes up for this disadvantag

P-Level 4H-N/SI260um±25um 2-Inch SiC Substrate For Power Devices And Microwave Devices JDCD03-001-001 2-inch SiC substrate P-level 4H-N/SI260μm±25μm for power devices and microwave devices Overview Key features Optimizes targeted performance and total cost of ownership for next generation power electronics devices Large diameter wafers for improved economies of scale in semiconductor manufacturing Range of tolerance levels to meet specific device fabrication needs High

4H SiC Epitaxial Wafer ≤0.2 /Cm2 150.0 Mm +0mm/-0.2mm 47.5 Mm ± 1.5 Mm JDCD03-001-004 Overview An epitaixal wafer is a wafer of semiconducting material made by epitaxial growth (called epitaxy) for use in making semiconductor and photonic devices such as light-emitting diodes (LEDs). Several methods of growing the epitaxial layer on existing silicon or other wafers are currently used: metal organic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE), LPE, HVPE.

P-MOS Grade 2-Inch SiC Substrate P-Level P-SBD Grade D Grade 150.0 mm +0mm/-0.2mm JDCD03-001-001 2-inch SiC substrate P-level 4H-N/SI260μm±25μm for power devices and microwave devices Overview At the system level, this results in highly compact solutions with vastly improved energy efficiency at reduced cost. The rapidly growing list of current and projected commercial applications utilizing SiC technologies includes switching power supplies, inverters for solar and windmill

JDCD03-001-004 SiC Epitaxial Wafer C-Face:Optical Polish,Si-Face:CMP Overview It involves the growth of crystals of one material on the crystal face of another (heteroepitaxy) or the same (homoepitaxy) material. The lattice structure and orientation or lattice symmetry of the thin film material is identical to that of the substrate on which it is deposited. Most importantly, if the substrate is a single crystal, then the thin film will also be a single crystal. Contrast with

6inch 4H-SiC Substrate N-Type P-SBD Grade 350.0±25.0μc MPD≤0.5/cm2 Resistivity 0.015Ω•cm—0.025Ω•cm For Power And Microw 6inch 4H-SiC substrate N-Type Overview SiC boules (crystals) are grown, machined into ingots, and then sliced into substrates, which are subsequently polished. A thin SiC epitaxial layer is then grown on top of this substrate to create an epi-wafer. Property P-MOS Grade P-SBD Grade D Grade Crystal Form 4H Polytype None Permitted Area≤5% (MPD) a ≤0.2 /cm2 ≤0

JDCD03-001-001 2-inch SiC substrate P-level 4H-N/SI260μm±25μm for power devices and microwave devices Overview The unique electronic and thermal properties of silicon carbide (SiC) make it ideally suited for advanced high-power and high-frequency semiconductor devices that operate well beyond the capabilities of either silicon or gallium arsenide devices. The key advantages of SiC-based technology include reduced switching losses, higher power density, better heat dissipation

2-Inch SiC Substrate 150.0 mm +0mm/-0.2mm 47.5 mm ± 1.5 mm No Secondary Flat JDCD03-001-001 2-inch SiC substrate P-level 4H-N/SI260μm±25μm for power devices and microwave devices Overview Our relentless focus on continuously improving materials quality and increasing substrate diameters directly benefits our customers and partners by improving their yields, reducing their costs, and enabling them to manufacture new generations of devices capable of even higher performance.

150.0mm +0mm/-0.2mm JDCD03-001-004 SiC Epitaxial Wafer 47.5 mm ± 1.5 mm Overview Because SiC has a high thermal conductivity, SiC dissipates heat more rapidly than other semiconductor materials. This enables SiC devices to be operated at extremely high power levels and still dissipate the large amounts of excess heat generated from the devices. The unique electronic and thermal properties of silicon carbide (SiC) make it ideally suited for advanced high-power and high

6inch 4H-SiC substrate N-Type P-SBD Grade 350.0±25.0μm MPD≤0.5/cm2 Resistivity 0.015Ω•cm—0.025Ω•cm for power and microwave devices Overview SiC boules (crystals) are grown, machined into ingots, and then sliced into substrates, which are subsequently polished. A thin SiC epitaxial layer is then grown on top of this substrate to create an epi-wafer. Silicon carbide, exceedingly hard, synthetically produced crystalline compound of silicon and carbon. Its chemical formula is SiC

6inch 4H-SiC substrate N-Type D Grade 350.0±25.0μm MPD≤5/cm2 Resistivity 0.014Ω•cm—0.028Ω•cm for power and microwave devices Overview Silicon Carbide (SiC) is a covalent network solid. If we look at its structure, we will find the atoms of silicon are joined together with carbon atoms with the help of a covalent bond tetrahedrally. We offer a complete SiC material solution with flexible specifications. Thick epilayers With or without buffer Multi-layer structures Various

6inch 4H-SiC substrate D-level SI-Type 350.0±25.0μm MPD≤5/cm2 Resistivity≥1E5Ω·cm for power and microwave devices Overview Sized for improved production With the 150 mm wafer size, we offer manufacturers the ability to leverage improved economies of scale compared with 100 mm device fabrication. Our 150 mm SiC Wafers offer consistently excellent mechanical characteristics to ensure compatibility with existing and developing device fabrication processes. 6inch 4H-SiC Semi

JDCD03-001-003 Overview A SiC wafer is a semiconductor material that has excellent electrical and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness. Property P-MOS Grade P-SBD Grade D Grade Crystal Form 4H Polytype None Permitted Area≤5% (MPD) a ≤0.2 /cm2 ≤0.5 /cm2 ≤5 /cm2 Hex Plates None Permitted Area≤5% Hexagonal Polycrystal

P-Level SI-Type 6inch 4H-SiC Semi insulating substrate 350.0±25.0μm MPD≤0.5/cm2 Resistivity≥1E9Ω·cm 6inch 4H-SiC substrate P-level SI-Type 350.0±25.0μm MPD≤0.5/cm2 Resistivity≥1E9Ω·cm for power and microwave devices Overview SiC has the following properties: Wide Energy Bandgap High electrical breakdown field High saturation drift velocity High thermal conductivity SiC is used for the fabrication of very high-voltage and high-power devices such as diodes, power transistors,

JDCD03-001-004 SiC Epitaxial Wafer Wafer Edge Beveling 350.0μm± 25.0 μm JDCD03-001-004 Overview Several methods of growing the epitaxial layer on existing silicon or other wafers are currently used: metal organic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE), LPE, HVPE. It involves the growth of crystals of one material on the crystal face of another (heteroepitaxy) or the same (homoepitaxy) material. The lattice structure and orientation or lattice

6inch 4H-SiC substrate N-Type P-MOS Grade 350.0±25.0μm MPD≤0.2/cm2 Resistivity 0.015Ω•cm—0.025Ω•cm for power and microwave devices Overview SiC is used for the fabrication of very high-voltage and high-power devices such as diodes, power transistors, and high power microwave devices. Epitaxial growth is used to produce active layers of silicon carbide (SiC)-based device structures with designed doping density and thickness, because control of doping and thickness in bulk

Beveling SiC Epitaxial Wafer 150.0 mm +0mm/-0.2mm 350.0μm± 25.0 μm JDCD03-001-004 Overview The 200-mm wafers can be used for a variety of applications. These wafers are 50% thinner than the standard silicon wafer, so the 200-mm diameter can be used for more SiC devices. The 200-mm size is much more efficient and will allow more devices to be built on the same size. A 200-mm-diameter SiC is a very expensive semiconductor, but its high yield makes up for this disadvantage.

150.0 mm +0mm/-0.2mm Sic Epitaxial Wafer Off-Axis:4°Toward ±0.5 ° JDCD03-001-004 Overview A SiC wafer is a semiconductor made of silicon. Its flatness, thermal conductivity, and electrical conductivity make it an ideal carrier for silicon. While the 150mm diameter is still the standard, there are several companies that produce 200mm-diameter SiC. A SIC wafer can be produced in a number of different ways, but the most common size is the one used for power conversion. The

6inch 4H-SiC Substrate N-Type P-SBD Grade 350.0±25.0μm MPD≤0.5/cm2 Resistivity 0.015Ω•Cm—0.025Ω•Cm For Power And Microw 6inch 4H-SiC substrate N-Type Overview Silicon carbide (SiC) is a non-oxide ceramic engineering material that has gathered a considerable amount of interest. The SiC particles pose a relatively low thermal expansion, high thermal conductivity, high hardness, and resistance to abrasion and corrosion. Property P-MOS Grade P-SBD Grade D Grade Crystal Form 4H