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Shanghai GaNova Electronic Information Co., Ltd.
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6
Years
Since 2020
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GaN Epitaxial Wafer
SiC Epitaxial Wafer
GaAs Epi Wafer
CVD Diamond Substrates
Rapid Thermal Annealing System
Hall Effect Sensor Tester
Aluminum Nitride Wafer
Laser Diode Chip
Silicon Carbide Crystal
Ga2O3 Wafer
Silicon Wafer
Sapphire Wafer
Patterned Sapphire Substrates
Wafer Holder
Wafer Dicing Machine
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GaN Epitaxial Wafer
SiC Epitaxial Wafer
GaAs Epi Wafer
CVD Diamond Substrates
Rapid Thermal Annealing System
Hall Effect Sensor Tester
Aluminum Nitride Wafer
Laser Diode Chip
Silicon Carbide Crystal
Ga2O3 Wafer
Silicon Wafer
Sapphire Wafer
Patterned Sapphire Substrates
Wafer Holder
Wafer Dicing Machine
Videos
About Us
Contact Us
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Products
Silicon Wafer (26)
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JDCD07-001-004 7 Inch SOI Epitaxial Wafer For MEMS Processing
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JDCD07-001-002 5 Inch SOI Epitaxial Wafer For MEMS Processing
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JDCD07-001-001 4-Inch SOI Epitaxial Wafer For MEMS Processing
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JDCD06-001-007 12-Inch Silicon Wafer MEMS Devices Integrated Circuits Dedicated Substrates For Discrete Devices
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JDCD06-001-006 8-Inch Silicon Wafer MEMS Devices Integrated Circuits Dedicated Substrates For Discrete Devices
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Sapphire Wafer (19)
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JDCD08-001-006 6inch C-Plane Sapphire Substrate Wafer
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JDCD08-001-003 2 Inch M Plane Sapphire Substrate Wafer
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JDCD08-001-002 2 Inch A-Plane Sapphire Substrate Wafer
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JDCD08-001-007 8inch C-Plane Sapphire Substrate Wafer
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JDCD08-001-005 4inch R-Plane Sapphire Substrate Wafer
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Patterned Sapphire Substrates (10)
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Patterned Sapphire Crystal Wafer 2inch Sapphire Substrate
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UKAS Patterned Sapphire Substrates Flat Edge Angle
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Flat Edge Angle 16mm Patterned Sapphire Substrates Front Surface
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A Plane Patterned Sapphire Substrates BOW -8 - 0μm Edge Round
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Patterned 2inch Sapphire Substrates LED Chip Substrate 50.80mm
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Wafer Holder (1)
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6inch Wafer Holder Cleaning Flower Baskets And Handles
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Wafer Dicing Machine (5)
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8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW
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0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm
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Silicon Wafer Dicing Machine 260mm Automatic Dicing Saw
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Automatic Wafer Dicing Machine 8 Inch 250mm × 250mm 300mm
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X Axis Cutting Range 260mm Wafer Dicing Machine Automatic Dicing Saw
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