Heat Press Kraft Paper

High-performance bamboo kraft paper engineered for PCB and CCL lamination processes. Features exceptional temperature resistance up to 220°C, precise dimensional stability with ±0.02mm thickness tolerance, and excellent thermal elasticity. Ideal for high-end electronic manufacturing with customizable sizes and multiple weight options from 160-320g/cm².

Premium bamboo-based Press Kraft Paper with high tear resistance and thickness precision (±0.02mm). Available in 160-320g/cm² weights and customizable sizes for PCB lamination, cushion packaging, and industrial wrapping applications. Sustainable material with smooth surface finish and flexible roll/sheet packaging options.

Premium bamboo-based kraft paper with 0.1-0.2mm thickness and ±0.02mm uniformity. Available in 160g/cm² to 320g/cm² weights for superior protection in packaging, wrapping, and lamination processes. Custom sizes, high durability, and smooth surface finish for professional results.

Premium bamboo-based press kraft paper with 0.1-0.2mm thickness and ±0.02mm uniformity. Features high tear resistance, smooth surface finish, and customizable sizes in rolls or sheets. Ideal for PCB lamination, industrial packaging, wrapping, and craft applications with multiple weight options available.

Premium bamboo-based kraft paper engineered for PCB lamination with exceptional 0.1-0.2mm thickness uniformity (±0.02mm). Available in 160-320g/cm² weights with customizable sizing. High tear resistance and smooth surface finish ensure reliable performance in industrial packaging and hot press applications.

Silicon-free release film for FPC lamination with 25μm thickness and 10-35gf/inch release force. Features TPX release layers, excellent dimensional stability, and prevents oil transfer contamination. Suitable for large-size FPC surfaces, steel sheet reinforcement, and soft metal pressing applications with superior adhesive resistance.

Industrial-grade kraft paper for PCB and CCL lamination with high temperature resistance up to 220°C. Features bamboo pulp construction, excellent thermal elasticity, and stable thickness uniformity of ±0.02mm. Ideal for high-end electronic manufacturing with superior breathability and non-stick properties.

Industrial-grade pressed kraft paper offering exceptional heat resistance up to 230℃ and multiple weight options from 160g/cm² to 320g/cm². Features superior press elasticity for enhanced PCB lamination yield, tear-resistant durability, and ISO/FSC/SGS certifications. Ideal for electronics manufacturing, packaging, and high-temperature processing applications.

Specialized high-temperature resistant kraft paper for PCB, CCL, and IC carrier board manufacturing. Withstands up to 230°C for lead-free soldering, provides excellent thermal elasticity and physical buffering. Available in multiple weights with 3-5 pressing cycles and moisture content below 7% for optimal performance in circuit board production processes.

Premium bamboo pulp kraft paper designed for PCB and CCL lamination processes. Withstands temperatures up to 220°C for 125 minutes, offers excellent thermal buffering and physical cushioning properties. Available in 160g/cm², 190g/cm², 254g/cm², and 320g/cm² weights with ±0.02mm thickness uniformity for consistent pressure distribution.