ESCP-KP-G1 160-320g/cm² High-Temperature Kraft Paper for PCB & CCL Lamination | 220°C Resistance

Specialized kraft paper manufactured from bamboo pulp using advanced processing techniques for PCB (Printed Circuit Board) and CCL (Copper Clad Laminate) lamination applications. This premium material offers superior performance characteristics compared to conventional wood pulp kraft paper.

• Enhanced Thermal Resistance: Withstands 220°C for 125 minutes without carbonization or brittleness, suitable for lead-free soldering processes
• Superior Thermal Elasticity: Excellent physical buffering properties with high flatness and stable heat transfer performance
• Optimal Breathability: Enhanced air permeability and cushioning characteristics extend product service life
• Non-Adhesive Surface: Prevents sticking to steel plates and eliminates particle shedding during pressing operations

Ideal for high-end PCB, CCL, IC carrier board, and aluminum substrate lamp manufacturing processes. Specifically engineered to meet the demanding pressing requirements of advanced electronics production.

• Maintains moisture content below 7% to prevent adhesion issues during pressing
• Consistent thickness uniformity (±0.02mm) ensures balanced pressure distribution and stable thermal buffering
• Available in multiple weight options from 160g/cm² to 320g/cm²