Laminating Film Roll

Specialized polyester release film designed for flexible printed circuit board (FPC) lamination processes. Available in 25-100μm thicknesses with double matte surfaces for easy handling. Features low static electricity to prevent dust contamination and minimal silicone oil transfer for reduced pollution risk in PCB manufacturing.

Specialized PET substrate release film for rigid PCB lamination processes. Available in 25μm to 100μm thicknesses with double matte surfaces, low static electricity, and superior high-temperature resistance. Ideal for PCB blind hole boards, slotted boards, and back panel manufacturing with minimal silicone oil transfer.

Industrial-grade TPX silicon-free release film for flexible printed circuit board lamination. Available in 25-100μm thicknesses with 10-35gf/inch release force. Features matte finish, excellent dimensional stability, and prevents oil transfer contamination. Ideal for FPC production with high adhesive resistance requirements and environmental benefits.

High temperature protective laminating film designed for FPC and RTR manufacturing processes. Features 115μm and 60μm thickness options with double-layer structure, offering excellent thermal resistance, easy adhesion/separation, and acid/alkali resistance. Ideal for single-sided protection, wet processes, and high temperature compression applications.

Specialized release film designed for FPC lamination processes featuring double matte surfaces, low static electricity, and minimal silicone oil transfer. Available in 25μm, 36μm, 50μm, 75μm, and 100μm thickness options with high-temperature PET substrate for reliable isolation and separation during flexible circuit board production.

Specialized polyester release film designed for FPC lamination processes. Features double matte surfaces, minimal static electricity, and low silicone oil transfer to prevent contamination. Available in 25μm, 36μm, 50μm, 75μm, and 100μm thickness options for flexible printed circuit board manufacturing applications.

Specialized high-temperature protective film designed for FPC and RTR manufacturing processes. Features exceptional heat resistance, easy adhesion and separation, and acid/alkali resistance. Available in 115μm and 60μm thicknesses with double-layer construction for reliable protection during wet processes, compression, and transportation.

Product Description:Silicon Free Release film is an improved special functional film specially used in the process of flexible printed circuit board (FPC). It features no silicon inside the film which cannot transfer the oil or other dirt to the processed board.In many production processes in high-tech fields, such as the FPC industry, silicon free release film is a key material that plays a crucial role in protecting products, preventing adhesion, and ensuring smooth

25-100um 3 layers Functional Release Film Used For RPC Lamination with High-temperature resistant Product Description: Release film special for rigid PCB (R-PCB) lamination Release film special for rigid PCB (R-PCB) lamination is a special purpose thin film specially used in the process of rigid printed circuit board (RPCB). Release film special for rigid PCB (R-PCB) lamination is also known or renamed as RPC release film, R-PCB lamination release film or functional release

Lamination Functional films of FPC release film Special for Flexible Printed Circuit Board Lamination Product Description: Release film special for flexible printed circuit board (FPC) lamination is a special purpose thin film specially used in the process of flexible printed circuit board (FPC). Release film special for flexible printed circuit board (FPC) lamination is also known or renamed as FPC release film, F-PCB lamination release film or functional release film used

FPCB RTR Processes 60um and 115um High Temperature Protective Film of Lamination Functional films Product Description: Introducing our High Temperature Protective Film, a versatile lamination functional film designed specifically for flexible PCB and RTR processes. This product is a game-changer in the industry, offering exceptional lamination performance and quality results. Our lamination functional film features a unique 3-layer structure that ensures superior performance

60um Thickness High temperature bearing film of Lamination Functional films for FPCB Protection Product Description: Introducing our High temperature bearing film of FPC and enhancement of FPC in roll to roll production process, a versatile lamination functional film designed specifically for rigid and flexible PCB applications. This product is a game-changer in the industry, offering exceptional lamination performance and quality results. Our lamination functional film

25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB 1.Introduction of 25-500um 3in1Release Film for RF-PCB Lamination functional film for Rigid and Flexible PCB/RF-PCB 3in1Release Film is suitable for filling and covering during the compression or lamination process of soft and hard circuit board (Rigid and Flexible PCB/RF-PCB). Model Thickness Structure Surface finish ESRF-3in1 25-500um 3 layers Matte or glossy 2. Product

60um Thickness Double-layer High Temperature Bearing Film Lamination Functional Film ESBF-60 1.Product application of 60um Thickness Double-layer High Temperature Bearing Film Lamination Functional Film ESBF-60 1). It is used for single area protection of FPC and enhancement of FPC in roll to roll production process. 2). It is suitable for acid and alkali resistant process protection and RTR compression or lamination process. Film type Thickness Structure ESBF-60 60um Double

Industrial-grade double-layer high temperature protective film available in 60um and 115um thicknesses. Features exceptional temperature resistance, easy adhesion/separation, and acid/alkali resistance. Ideal for FPC manufacturing, wet processes, compression protection, and panel transportation. Three-layer PET structure ensures reliable performance in demanding electronic production environments.

Advanced 3-layer lamination film engineered for rigid and flexible PCB applications. Features superior temperature resistance, dimensional stability, and compatibility with various core sizes. Available in matte or glossy finishes with thickness options from 25-500μm. Ideal for RF-PCB manufacturing and electronics industry applications requiring high-performance lamination solutions.

Specialized release film for FPC lamination featuring double matte surfaces, minimal static electricity, and low silicone oil transfer. Available in thicknesses from 25μm to 100μm with matte glossy finish. Provides reliable isolation and separation during flexible circuit board manufacturing processes.

Specialized 0.075mm polyester release film designed for flexible printed circuit board (FPC) lamination. Features double matte surfaces, minimal static electricity, and low silicone oil transfer to prevent contamination. Available in multiple thicknesses from 25μm to 100μm for various FPC manufacturing requirements.

Specialized FPC release film for flexible printed circuit board lamination with double matte surfaces, low static electricity, and minimal silicone oil transfer. Available in multiple thickness options from 25μm to 100μm, this functional film provides reliable isolation and separation during electronic manufacturing processes.

Specialized 60μm protective film designed for FPC manufacturing in roll-to-roll processes. Features high temperature resistance, acid/alkali protection, and clean peel-off with no adhesive residue. Ideal for single-sided protection during pressing, electroplating, and lamination operations.