Copper Clad Laminate Plate
CCL Ra0.15 Copper Clad Laminate Lamination Steel Plate 1.5-2.0mm Thick NAS630 Material for PCB Manufacturing
High-precision CCL lamination steel plate with Ra≤0.15 surface roughness and 1.5-2.0mm thickness options. Features Japanese NAS630 steel with ≥1400 N/mm² tensile strength, 50HRC hardness, and thermal conductivity ≥25W/MK. Designed for 8-10 year service life with minimal warpage (≤3mm/M) and excellent thermal stability for PCB production applications.
ESSP-S630T Copper Clad Laminate Press Plate 2220×1270mm SUS630T Steel 1.0-2.0mm Thickness
High-precision SUS630T steel lamination plate for PCB and CCL production with 50HRC hardness and ≥18W/MK thermal conductivity. Features competitive pricing, high corrosion resistance, and dimensional stability with ≤3mm/M warpage. Available in standard sizes up to 2410mm length with custom options.
NAS301 JAPAN Material CCL Lamination Steel Plate 1.0-1.8mm Thickness for PCB Manufacturing
High-precision NAS301 JAPAN steel plate for CCL copper clad laminate lamination, featuring ≤400°C working temperature, ≥1175 N/mm² yield strength, and ≥18W/MK thermal conductivity. Designed for reliable PCB production with exceptional durability and thermal performance in industrial applications.
SUS301H Copper Clad Laminate Plate 450 HRC Hardness for PCB Manufacturing with ≤0.03 Parallelism
Premium Japanese SUS301H steel CCL press plate with 450 HRC hardness and ≤280℃ temperature resistance. Features ≤0.03 parallelism, ≤3mm/M warpage degree, and glossy surface finish for precision PCB lamination applications. Ideal for electronics, automotive, and aerospace industries requiring durable, high-performance manufacturing materials.
SUS301H Copper Clad Laminate Plate 450 HRC Hardness ≤280℃ Temperature Resistance for PCB Manufacturing
Premium SUS301H Japanese steel copper clad laminate plate with 450 HRC hardness and ≤280℃ temperature resistance. Features precision parallelism ≤0.03, minimal warpage ≤3mm/M, and glossy surface finish. Ideal for CCL press machines, lamination processes, and PCB partitioning in electronics manufacturing. Available in 0.5mm, 1.0mm, and 1.2mm thicknesses with dimensions up to 1300mm × 2410mm.
Japanese NAS301 Copper Clad Laminate Plate 1.0-1.8mm Thickness, 44HRC Hardness for PCB & CCL Applications
Premium copper clad laminate plate manufactured with Japanese NAS301 material. Features 44HRC hardness, thermal expansion coefficient of 10-12 (10⁻⁶/°C), and operating temperature up to 400°C. Ideal for PCB fabrication and CCL lamination with precise dimensional control and superior surface quality.
NAS301 Copper Clad Laminate Press Plate 1.0-1.8mm Thickness for PCB Manufacturing with 44HRC Hardness
High-precision NAS301 Japan material copper clad laminate press plate designed for CCL manufacturing processes. Features 1.0-1.8mm thickness, 44HRC hardness, and thermal conductivity ≥18W/mK at 300°C. Ideal for PCB production with operating temperatures up to 400°C and exceptional mechanical strength for reliable circuit board fabrication.
1295 x 1143 Copper Clad Laminate Steel Plate NAS630 1.0-2.5mm Thick with 50HRC Hardness for PCB Manufacturing
Premium Japanese metallurgical NAS630 copper clad laminate steel plates with 1.0-2.5mm thickness and 50HRC hardness. Features ultra-high yield strength (≥1175 N/mm²), excellent thermal conductivity (≥25 W/m·K), and minimal warpage for superior CCL lamination performance. Compatible with all major laminator brands and offers 8-10 year service life.
1.0-2.5mm Copper Clad Laminate Steel Plate NAS630 with ≤3mm/M Warpage and 50 HRC Hardness for CCL Manufacturing
High-precision copper clad laminate steel plate with 1.0-2.5mm thickness range and ≤3mm/M warpage degree. Features Japanese NAS630 metallurgy, ≥1175 N/mm² yield strength, ≥25 W/MK thermal conductivity, and 8-10 year service life. Ideal for CCL manufacturing in PCB production with compatibility for major laminator systems.
CCL Lamination Steel Plate 1.5-2.0mm Thick with 25W/MK Thermal Conductivity for PCB Manufacturing
Premium Japanese NAS630 & NAS301 steel plates offering exceptional thermal conductivity (≥25W/MK), ultra-high hardness (50HRC±2), and minimal warpage (≤3mm/M). Designed for copper clad laminate production with 8-10 year service life, ±0.05mm thickness tolerance, and multiple standard sizes for flexible industrial applications.
1mm High Precision Copper Clad Laminate Plate CCL-400 with ±0.05mm Tolerance and ≥1400 N/mm² Tensile Strength
ESSP-CCL-400 copper clad laminate steel plate offers exceptional dimensional precision with ±0.05mm thickness tolerance and high mechanical strength. Features include thermal conductivity ≥25W/MK, 8-10 year service life, and multiple size options for circuit board manufacturing. Available in 1.5-2.0mm thicknesses with quick delivery and comprehensive technical support.
NAS630 Copper Clad Laminate Steel Plate 1.8mm-2.5mm Thickness for PCB Manufacturing with 50HRC Hardness
Premium Japanese NAS630 steel plate for copper clad laminate (CCL) manufacturing. Features 1.0-2.5mm thickness range, 50HRC hardness, and ≥1175 N/mm² yield strength. Provides excellent thermal conductivity, minimal warpage, and 8-10 year service life. Compatible with major CCL laminator brands including BURKLE and LAUFFER.
ESSP-S630T PCB CCL Lamination Steel Plate 2220×1270mm SUS630T Material 50HRC Hardness
High-precision SUS630T steel lamination plate for PCB and copper clad laminate manufacturing. Features 50HRC hardness, ≥1400 N/mm² tensile strength, and excellent thermal conductivity up to 18W/MK. Available in standard 2220×1270mm or custom sizes with competitive pricing and reliable performance for industrial lamination processes.