Epoxy Potting Compound

22 kV/mm High Dielectric Epoxy Potting Compound HN-5508A/B – Capacitor, Transformer & Sensor Encapsulation Hanast HN-5508A/B is a high dielectric strength (22 kV/mm) epoxy potting compound purpose-engineered for electrical and electronic components requiring superior high voltage insulation. Formulated as a two-component black epoxy system, it delivers exceptional dielectric protection for capacitors, transformers, industrial sensors, and LED modules operating in high-voltage

5:1 Black Epoxy Potting Compound HN-5508A/B – Transformer & Power Supply Encapsulation Hanast HN-5508A/B is a high-performance 5:1 black epoxy potting compound specifically engineered for transformer manufacturing and power supply module encapsulation. With a Shore D hardness of 85-95 after full cure, it forms an exceptionally tough, acid-and-alkali-resistant protective shell that shields critical electronic components from moisture, chemical attack, vibration, and unauthoriz

High Transparency Epoxy Potting Compound HN-5506A/B – 2:1 Self-Leveling AB Glue Hanast HN-5506A/B is a high transparency two-component epoxy potting compound designed for electronic encapsulation applications where optical clarity and high voltage insulation are critical. With a 2:1 mix ratio by weight and self-leveling low-viscosity formulation, it flows effortlessly into narrow gaps and complex component structures before curing to a crystal-clear, hard protective layer at

Hard Low Bubble Epoxy Potting Compound Low Viscosity Smooth Surface For Aquarium Equipment Encapsulation Description of Epoxy Potting Compound Two-part epoxy potting compound is an epoxy resin-based liquid encapsulant blended with functional additives and curing agents. It is widely applied to encapsulate electronic parts for electrical insulation, moisture sealing and comprehensive component protection. After full curing, it hardens into a rigid, high-hardness insulating

High Transparency Epoxy Potting Compound For Electronics 2:1 Self-Leveling AB Glue, Ideal For LED Modules, Sensitive Components & High Voltage Insulation Description of Epoxy Potting Compound The 2:1 Transparent Epoxy Potting Compound is a two-component epoxy resin encapsulation material designed to be mixed at a weight ratio of 2:1 (Part A:Part B). Characterized by its complete transparency, high hardness upon curing, and excellent insulating properties, it is specifically

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer Product description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof,

5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp

3:1 Epoxy Potting Compound With Low Viscosity Long Operational Time Suitable for Transformers Sensors Resistors Filters PCB Battery Power Moulds Car Electronics Protection HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp

HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage storage Period (25℃) Six months x months processabilility mixing ratio A: B =5:1 (weight ratio) Available for a time of 25℃ 2-3H (100g mix) curing time 25℃ / 6-8H