Hard Low Bubble Epoxy Potting Compound Low Viscosity Smooth Surface For Aquarium Equipment Encapsulation
Hard Low Bubble Epoxy Potting Compound Low Viscosity Smooth Surface For Aquarium Equipment Encapsulation
Description of Epoxy Potting Compound
Two-part epoxy potting compound is an epoxy resin-based liquid encapsulant blended with functional additives and curing agents. It is widely applied to encapsulate electronic parts for electrical insulation, moisture sealing and comprehensive component protection. After full curing, it hardens into a rigid, high-hardness insulating shell.
Product Features of epoxy potting compound:
1. Outstanding Electrical Insulation
Boasting ultra-high volume resistivity and dielectric strength, it reliably blocks electric leakage for electronic assemblies.
2. All-Round Physical Barrier
After curing, the rigid epoxy layer delivers robust defense against water, humidity, dust and mechanical vibration.
3. Reliable Chemical Resistance
It features great stability against acids, alkalis, salt mist and most common organic solvents.
Application of epoxy resin potting:
Wide Application in Electronics, Electrical Equipment, Automotive and New Energy Industries
1. Power Components: Encapsulation & heat dissipation for transformers, charging equipment and inverters
2. Sensors: Hermetic waterproof sealing for auto sensors and industrial detection probes
3. PCB Boards: Provide anti-corrosion protection and mechanical reinforcement for delicate electronic components
How to use epoxy potting compound:
Step-by-Step Operation Guide
1. Preparation: Clean and dry components completely; stir resin Part A well in advance.
2. Weight Mixing: Strictly follow 5:1 weight ratio (not volume). Example: 500g A + 100g B, weigh with precise scale.
3. Gentle Stirring: Stir slowly in one direction for 3–5 mins to avoid bubble generation.
4. Bubble Elimination (Vital): Vacuum for 3–5 mins; or rest 15–30 mins to release bubbles.
5. Slow Pouring: Pour at a steady flow, or pour twice to cut void formation.
6. Curing Schedule: 24h full cure at 25°C; accelerated curing: 2–4h at 60–80°C.
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