Epoxy Potting Compound

HANAST HN-5506 A/B High Transparency UV Resistant Epoxy Potting Compound for LED Display Module and Optical Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardness, low viscosity, excellent self-levelling and defoaming performance. Mixed at a 3:1 ratio by weight, it flows into fine gaps and cures into a crystal-clear, high-hardness, UV-resistant and anti-yellowing encapsulant with excellent adhesion, low cure shrinkage and

HANAST HN-5508 A/B 85-95 Hardness Electrical Epoxy Potting Compound for Temperature Sensors & Controllers HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound developed for the electrical and electronics industry. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant with high dielectric strength. It is especially

Clear Epoxy Potting Compound 5:1 High Hardness 80 Shore D Waterproof Insulating Resin for Electric Motor Stator Encapsulation HN-5508AB is a clear two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for electric motor stator encapsulation, motor coil protection and winding insulation . It cures at room temperature or low temperature with low viscosity and long operation time, giving excellent fluidity and easy penetration into stator slots, coil

Flame Retardant Thermally Conductive Epoxy Potting Compound for Marine Lithium Battery Packs A high-performance, two-component epoxy potting and encapsulation compound engineered for the thermal management and mechanical protection of marine lithium battery packs and other demanding electronic assemblies. Thermal conductivity 1.0 W/mK. Product Overview This two-component flame-retardant and thermally conductive epoxy potting compound forms a rigid, high-strength encapsulant

HANAST HN-5508 A/B Electronics Grade Biocompatible ISO 10993 Epoxy Potting Compound for Medical Device Electronics Protection HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound formulated for electronics-grade, medical-device encapsulation. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant.

HANAST HN-5508 A/B High Reliability Electronics Grade Epoxy Potting Compound for Power Module, Aerospace and Defense Electronics Protection HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for high-reliability, electronics-grade encapsulation. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black

Black Epoxy Potting Compound 5:1 Fire Retardant High Temperature Encapsulant for Power Supply Module HN-5508AB is a black two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for power supply module, LED driver and other electronic component encapsulation . It cures at room temperature or low temperature with low viscosity, long working time and good fluidity, easily penetrating into narrow clearances of the product. After curing it delivers a

HANAST HN-5508 A/B Low Outgassing Black Epoxy Potting Compound for Hydrogen Fuel Cell, Vacuum Electronics and Power Module Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for vacuum electronics, new-energy power modules and other high-reliability applications. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high

HANAST HN-5508 A/B 5:1 Flame Retardant Epoxy Potting Compound for EV Battery, Power Module and New-Energy Electronics Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for the electronics, electrical and new-energy industries. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black

HANAST HN-5508 A/B 5:1 Black Epoxy Potting Compound for Transformer, Power Supply and Sensor Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound developed for the electronics and electrical industry. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. It combines high dielectric

HANAST HN-5508 A/B Waterproof Electrical Epoxy Potting Compound 200kg for Electronics Encapsulation HN-5508 A/B is a two-component, waterproof electrical epoxy potting compound developed for the electronics and electrical industry. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. It provides strong electrical insulation, moisture and water

HANAST HN-5506 A/B High Transparency High Voltage Epoxy Potting Compound for Power Module and High-Voltage Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardness, low viscosity, excellent self-levelling and defoaming performance. Mixed at a 3:1 ratio by weight, it flows into fine gaps and cures into a crystal-clear, high-hardness, UV-resistant and anti-yellowing encapsulant with excellent adhesion and high dielectric strength

HANAST HN-5506 A/B High Transparency Epoxy Potting Compound for Industrial Sensor Housing and High-Voltage Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardness, low viscosity, excellent self-levelling and defoaming performance. Mixed at a 3:1 ratio by weight, it flows into fine gaps and cures into a crystal-clear, high-hardness, UV-resistant and anti-yellowing encapsulant with excellent adhesion, high dielectric strength

Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for narrow gap and fine clearance encapsulation of electronic components. After mixing it exhibits excellent flowability and low viscosity, allowing it to easily penetrate into the minute gaps between components, coils and PCB traces before curing into a

HANAST HN-5508 A/B CTE Matched Thermal Cycling Resistant Epoxy Potting Compound for Motor Stator and Power Module Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for electronics exposed to repeated thermal cycling. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, penetrates narrow gaps, and cures bubble-free into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant.

Transparent Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70 Shore D for Wind Turbine Converter Encapsulation HN-5506A/B is a high-transparency two-component epoxy potting compound with a 2:1 mix ratio, specially formulated for wind turbine converter encapsulation, power electronics protection and high-voltage insulation. The self-leveling low-viscosity system flows easily around PCBs, IGBT modules and sensitive components, and cures into a transparent, hard, bubble-free

Halogen Free Two Component 5:1 Clear Potting Epoxy Resin Compound Encapsulant Raw Material For LED Driver This halogen-free two component 5:1 clear epoxy potting compound is developed for LED driver and power module encapsulation. It delivers UL 94 V-0 flame retardancy and stable electrical insulation under continuous operation. Key Features Halogen Free: Environmentally friendly formulation meeting ROHS and SGS requirements Clear Appearance: Transparent cured surface enables

HANAST HN-5508 A/B Chemical Resistant Black Epoxy Potting Compound (Bulk Supply) for Electronics and Transformer Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered for chemical and mechanical protection of industrial electronics. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant. Its

HANAST HN-5508 A/B Customized Black Epoxy Potting Compound 5:1 for LED Driver & Electronics Encapsulation HN-5508 A/B is a customizable two-component black epoxy potting compound developed for the electronics industry. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, penetrates narrow gaps, and cures into a smooth, glossy, high-hardness (Shore D 85-95) black encapsulant with high dielectric strength. It is widely chosen for LED drivers, power

UL94 V-0 Clear Epoxy Potting Compound 5:1 Two Component Encapsulant for EV Onboard Charger Module HN-5508AB is a clear two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for EV onboard charger (OBC) module and high voltage power electronics encapsulation . The halogen-free formulation delivers UL 94 V-0 flame retardancy, stable electrical insulation and excellent moisture protection under continuous high voltage operation, making it a reliable