Epoxy Potting Compound

Clear Potting Epoxy Ab Glue Epoxy Potting Material High Hardness 80 Shore Waterproof Potting Adhesive For Circuit Board Power Module Transformer Product description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof,

HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage storage Period (25℃) Six months x months processabilility mixing ratio A: B =5:1 (weight ratio) Available for a time of 25℃ 2-3H (100g mix) curing time 25℃ / 6-8H

Processing Customized High Transparent Jelly Silicon Gel PCB Circuit Board Protection Shockproof Repairable Electronic Silicon Gel Characteristic 1. Stable physical and chemical properties, with a wide temperature resistance of -60~230 ℃; 2. Low viscosity, easy to use, no solid fillers, fully transparent, and easy to observe sealing components; 3. Capable of repeated operation, repairability, high flexibility, and extremely low shrinkage rate; 4. Good dust-proof, moisture

Epoxy Potting Glue With Low Viscosity Long Operational Time Suitable for Transformers Resistors Filters Electronic Appliances HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage storage Period (25℃) Six months x months

Silicone Manufacturer Flame Retardant Epoxy Potting Glue For Temperature Sensors Controllers Ignition Coils Epoxy Electronic Potting Glue 5:1 Epoxy Potting Compounds Product Description: HN-5508A/B epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness Technical Parameter curing builder Epoxy resin 5508A

Hardness Customized Black Epoxy Potting Compound 5:1 Fire Retardant High Temp Potting Epoxy Resin For Automobile Motorcycle Ignition LED Driver Power Supply 2 Parts Electronic Potting Glue Product Description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness technical parameter uring builder

Black Epoxy Potting Compound 5: 1 Electronic Potting Ab Glue For Transformer Circuit Board Power Module High Hardness Two-Component Epoxy Potting Sealant Glue Product Description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture

2:1 Epoxy Potting Compound For Transformers Power Module Insulation Sealing Led Driver RTV Potting Glue Fire Retardant High Temp Potting Epoxy Resin Product Description HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators, ultrasonic atomizers, and electronics and other components HN-5508 epoxy resin at room temperature or low temperature, with low

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver Product description: HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators, ultrasonic atomizers, and electronics and other components that require insulation, flame retardant, and temperature resistance. It has flame retardant insulation,

3:1 Epoxy Resin Potting Glue for LED Driver Transformers Resistors Power Module High Hardness 2 Parts Transparent Potting Glue Compound Product Description: HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness Main Features: Flame retardant insulation, sealing bonding, moisture-proof earthquake

OEM Silicone Black Epoxy Potting Compound Resin Glue 5:1 For Electrical Led Driver High Hardness Potting Glue HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness Features Flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, low-temperature resistance. Applications HN

5:1 Electronic Epoxy Potting Glue Waterproof Sealing Insulation For Power Module Circuit Board Electrical Sealant for Transformers Resistors Filters Electronic Appliances HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp

Epoxy Potting Glue With Low Viscosity Long Operational Time Suitable for Transformers Resistors Filters Electronic Appliances HN-5508 Industrial Potting Compound Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage storage Period (25℃) Six months x

3:1 Epoxy Potting Compound With Low Viscosity Long Operational Time Suitable for Transformers Sensors Resistors Filters PCB Battery Power Moulds Car Electronics Protection HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp

HN-5508 Epoxy Resin Potting Glue Product Specification Before curing builder Epoxy resin 5508 Curing agent 5508 pigment Black / White et al Ruburn / transparent surface Surface A sticky epoxy resin water r liquid specific specific gravity, g / cm3 1.4-1.5 1.05 Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage storage Period (25℃) Six months x months processabilility mixing ratio A: B =5:1 (weight ratio) Available for a time of 25℃ 2-3H (100g mix) curing time 25℃ / 6-8H