Ultra Soft Thermal Gap Filler 12±5 Shore 00 with 1.5 W/mK Conductivity for GPS and Portable Devices
Price:
negotiation
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
ZIITEK
Product Description
Product Overview
The TIF1120-05ES ultra soft thermal gap filler is engineered for efficient heat transfer in compact electronic devices. This ceramic-filled silicone rubber material fills gaps between heating and cooling components while providing insulation, damping, and sealing functions to support miniaturized and ultra-thin equipment designs.
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 |
| Thickness | 3.0mm | - |
| Hardness | 12±5 Shore 00 | ASTM 2240 |
| Density | 2.0 g/cm³ | ASTM D297 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Fire Rating | 94 V0 (UL equivalent) | - |
Key Features
- Excellent thermal conductivity of 1.5 W/mK
- Ultra soft 12±5 Shore 00 hardness for optimal conformability
- Moldable for complex component shapes
- Superior thermal performance across temperature ranges
- UL 94 V0 fire rating for safety compliance
Applications
- GPS navigation systems and portable devices
- Automotive electronics and LED ceiling lamps
- CPU cooling and display card thermal management
- Motherboard thermal interfaces and power adapters
- Mass storage devices and monitoring power boxes
Technical Documentation
Manufacturer Information
Ziitek Company brings over 13 years of thermal interface material expertise with proprietary formulations and core technologies. Our 5,000-10,000 square meter facility in Guangdong Province, China delivers quality competitive products for global customers seeking long-term partnerships.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai