2.0 W/mK Thermal Gap Pad 0.5mm Soft Silicone for LED Controller Heat Dissipation
TIF®️120-20-10UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity: 2.0 W/mK
- Thickness: 0.5 mmT
- Moldability for complex parts
- Soft and compressible for low-stress applications
- Naturally tacky, requiring no additional adhesive coating
- LED Power Supply
- LED Controller
- LED Ceiling Lamp
- Monitoring the Power Box
- AD-DC Power Adapters
- Rainproof LED Power
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m·K) | 2.0 | ISO 22007 |
- Standard Thickness: 0.010" (0.25 mm) ∼ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
- Standard Size: 16" × 16" (406 mm × 406 mm).
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
- Adhesive Options: A1/A2 (Single-sided / Double-sided adhesive).
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Ziitek, founded in 2006, is a high-tech enterprise focusing on independent research and development, production, and sales. The company is committed to providing customers around the world with products and overall solutions for heat conduction, heating, sealing, and EMI. Headquartered in Dongguan, Guangdong Province, Ziitek has production bases in Kunshan (Jiangsu Province), Taiwan Province, and Vietnam. This global production capacity layout ensures rapid response and efficient delivery.
With an R&D team composed of senior engineers, Ziitek is driven by independent innovation and continues to develop cutting-edge products that meet the needs of new energy vehicles, energy storage systems, AI servers, 5G communications, aerospace, and other fields — with the goal of becoming a trusted strategic partner of customers.
A: To request samples, you can leave us a message on our website, or simply contact us by email or phone.
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
A: We are a manufacturer based in China and Vietnam.
A: Generally it is 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock. It depends on the quantity.
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases, and phase-change materials.
A: Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression, and contact area.
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
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