75 Shore 00 Thermal Gap Pad 2.0 W/mK 4.0mm Easy Release for LED Module
TIF®1160-20-10UF Series is a structurally supportive thermal pad designed to provide effective heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity: 2.0 W/mK
- Thickness: 4.0 mmT
- Hardness: 75 Shore 00
- Color: Gray
- Moldability for complex parts
- Soft and compressible for low-stress applications
- Waterproof LED power supplies
- SMD LED modules
- LED flexible strips and LED bars
- LED panel lights
- LED floor lights
- Routers
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m·K) | 2.0 | ISO 22007 |
- Standard Thickness: 0.010" (0.25 mm) ∼ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
- Standard Size: 16" × 16" (406 mm × 406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided / Double-sided adhesive)
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Ziitek, founded in 2006, is a high-tech enterprise with independent research and development as its core driving force, focusing on the development and manufacture of heat conduction, heating, sealing, and EMI products. The company gathered senior engineers to form a research and development team. In the wave of continuous innovation in the manufacturing industry, it constantly broke through the material technology boundary and successively developed many core products such as TIF thermal pad, TIG thermal paste, TIC phase change material, TIF900 series EMI material, K-heat heating product, and Z-foam seal. Headquartered in Dongguan, with production bases in Kunshan, Taiwan Province, and Vietnam, the company empowers new energy, AI, 5G, aerospace, and other fields with technological innovation to provide leading thermal management solutions for global customers.
- ISO 9001:2015
- ISO 14001:2004
- IATF 16949:2016
- IECQ QC 080000:2017
- UL
A: To request samples, you can leave us a message on the website, or simply contact us by email or phone.
A: We are a manufacturer in China and Vietnam.
A: Generally it is 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock. It depends on the quantity.
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases, and phase-change materials.
A: Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression, and contact area.
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
A: Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area, and interface conditions.
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