Silicone Thermal Grease 5.0 W/mK 1Kg High Conductivity for Heat Sink Electronic Components
TIG®️780-50 is a paste-like thermal interface material designed specifically for the heat dissipation of various high and medium power electronic components. Under typical assembly pressure and small filling thickness, the material can fully wet the contact surface, effectively eliminate interface air, and form a continuous heat conduction path. This product can be widely used in general electronic equipment cooling scenarios that require both cost and performance, such as network communication, security monitoring, household appliances, and conventional industrial control hardware.
- Low thermal impedance
- Non-toxic and environmentally safe
- Excellent long term stability
- Thoroughly wets out contact surfaces to create low thermal impedance
- CPU
- Display card
- Mainboard/mother board
- Notebook
- Power supply
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- LED lighting
- ASIC chip
- Interface filling of CPU, GPU, and heat dissipation module
- Vehicle control unit
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction | Ceramic filled silicone | - |
| Bond Line Thickness (mm) | 0.031 | - |
| Density (g/cm³) | 2.3 | ASTM D792 |
| Viscosity (mPa*s) @25℃ | 450000 | GB/T 10247 |
| Recommended Operating Temperature (°C) | -45~200 | - |
| Thermal Conductivity (W/mK) | 5.0 | ISO22007 |
| Thermal Impedance (℃.in²/W) @30psi | 0.013 | ASTM D5470 |
| Volume Resistivity (Ohmd*cm) | ＞1.0x10¹³ | ASTM D257 |
| Volatility Loss (%) @150℃,24hrs | ＜0.1 | - |
Packing specification 0.5kg, 1kg, 2kg; For other specifications, please contact us.
Store from 5°C to 25°C with a maximum humidity of 70%. Do not store in freezer or refrigerator below 0°C. Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
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