Electrically Isolating Silicone Thermal Pad 1.5W/mK 0.5mm to 5.0mm for Power Box Monitoring
The TIF ®100-01S uses a special process with silicone as the base material, adding thermal conductive powder and flame retardant to create an effective thermal interface material. This significantly reduces thermal resistance between heat sources and heat sinks.
- Good thermal conductivity: 1.5W/mK
- Naturally tacky - no additional adhesive coating required
- Available in various thicknesses
- Broad range of hardness options
- Moldable for complex parts
- Cooling components to chassis or frame
- High-speed mass storage drives
- Heat sinking housing for LED-lit BLU in LCD
- LCD TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
- CPU cooling
- Memory modules
- Routers
- Medical devices
- Audio electronic products
- Unmanned aerial vehicles (UAV)
| Property | Value | Test Method |
|---|---|---|
| Color | Black | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 2.1 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | - |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 4.5 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | ＞1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 1.5W/m-K | ISO22007 |
Thickness: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm)
Standard Size: 16" x 16" (406mm x 406mm)
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
- PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized packaging available
Lead Time: 5000 pieces - To be negotiated
Ziitek Electronic Material and Technology Ltd. is an R&D and production company specializing in thermal conductive materials. We operate multiple production lines with advanced processing technology and optimized processes to provide comprehensive thermal solutions for various applications.
- ISO9001:2015
- ISO14001:2004
- IATF16949:2016
- IECQ QC 080000:2017
- UL Certified
Independent R&D team
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