Non Silicone Thermal Gap Pad 6.0W High Conductivity for Telecommunication Equipment 1.0-5.0mm
The Z-Paster ®100 6060-11 series is a siloxane-free thermally conductive interface material designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components.
- High thermal conductivity
- Silicone-free composition
- Available in different thickness options
- High compliance adapts to various pressure application environments
- Heat dissipation structure for radiators
- Telecommunication equipment
- Automotive electronics
- Battery packs for electric vehicles
- LED TV and lamps
| Property | Value | Test Method |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction | Non-Silicone resin | ***** |
| Thermal Conductivity | 6.0 W/mK | ASTM D5470, ISO 22007 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Density | 3.3g/cm³ | ASTM D297 |
| Thickness range | 0.040~0.200"/1.00~5.00mm | ASTM D374 |
| Breakdown Voltage | ≥5500 V/mm | ASTM D149 |
| Dielectric Constant @1MHz | 9.0 | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Operating Temperature | -45 ~ 125 ℃ | ***** |
| Flame Rating | V-0 | UL94 (E331100) |
Standard Thickness: 0.040" (1.00 mm)～0.200" (5.00 mm) with increments of 0.010 (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
The Z-paster® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
- PET film or foam for protection
- Paper card to separate each layer
- Export carton inside and outside
- Customized packaging available
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
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