2.5W/mK Silicone Thermal Pad EV Thermal Interface Material For Battery Pack Thermal Management

The TIF^®100 2540-11 Series is a versatile thermal pad with balanced performance. It offers good thermal conductivity and moderate hardness. This balanced design combines good surface fit and excellent operational convenience, providing effective heat transfer paths and basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium-power heat dissipation needs, achieving an optimal balance between cost and performance.

• Good thermal conductivity
• Moldability for complex parts
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• High tack surface reduces contact resistance

• Heat dissipation structure for radiators
• Telecommunication equipment
• Automotive electronics
• Battery packs for electric vehicles
• LED TV and lamps
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)
• CPU

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"X16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

• With PET film or foam for protection
• Use Paper Card To Separate Each Layer
• Export carton inside and outside
• Meet with customers' requirement-customized

Lead Time: Quantity(Pieces): 5000 | Est. Time(days): To be negotiated