High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics
Price:
Negotiation
MOQ:
1000 tubes
Delivery Time:
7-15work days
Brand:
ZIITEK
Product Description
High Thermal Conductivity Gap Filler Thermal Conductive Gel For AI Server & Automotive Electronics
Product Overview
TIF®040-49 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance.It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.
Key Features
- High Thermal conductivity
- Soft, very low compression
- Ultra thin interface
- Operate automatically
- Long-term reliability
Applications
- Heat-sink & frame
- LED backlight module, LED lighting
- High speed hardware driver
- Micro heat pipe radiator
- Vehicle engine controller
- Communication hardware
- Semiconductor automatic laboratory equipment
Technical Specifications of TIF®️040-49
| Property | Value | Test Method |
|---|---|---|
| Color | Pink | Visual |
| Construction | Ceramic filled silicon material | ZKTM J024 |
| Flow Rate (g/min) (30cc syringe/ 2.5mm orifice/90 psi) |
130 | ZKTM B014 |
| Density (g/cm³) | 3.15 | ASTM D792 |
| Thermal conductivity (W/mK) | 4.0 | ASTM D5470 |
| Thermal impedance (℃-in²/W) @10psi | 0.109 | ASTM D5470 |
| Thermal impedance (℃-in²/W) @50psi | 0.093 | ASTM D5470 |
| Recommended Operating Temperature | -40~200℃ | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥1500 | ASTM D149 |
| Bond Line Thickness (mm) | 0.13 | ZKTM B047 |
| Flame Rating | V-0 | UL 94 |
| Volatility Loss (%) @150°C, 24 hrs | ＜1 | HG/T 2502 |
Product Specifications
30cc/pcs, 50cc/pcs, 300 cc/pc, or custom packaging for automated applications.
For more information about thermal conductive materials, please contact our company.
Our Services
- Online-service: 12 hours, Inquiry reply within fastest
- Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
- Well-trained & experienced staff are to answer all your inquiries in English
- Standard Export Carton Or Marked With Customer's Information Or Customized
- Provide free samples
- After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution
Frequently Asked Questions
Q: What is Thermal Gel?
A: Thermal gel is a TIM (Thermal Interface Material) with good flowability and gap-filling capability. It can be applied through dispensing, coating, or other application methods to fill gaps between heat sources and cooling structures.
Q: What is the main advantage of Thermal Gel?
A: The main advantage of thermal gel is its ability to adapt to complex structures and irregular gaps. It is particularly suitable for applications where multiple components with different heights need to be thermally managed simultaneously.
Q: What size gap is Thermal Gel suitable for?
A: The applicable gap range varies depending on the specific thermal gel. It should be determined based on the product's flowability, curing characteristics, and assembly structure.
Q: Will Thermal Gel flow or leak?
A: Different thermal gels have different rheological properties. During engineering design, factors such as high-temperature sag, flow behavior, and long-term stability should be evaluated to ensure reliable performance.
Q: Does Thermal Gel need to be cured?
A: It depends on the product type. Some thermal gels are non-curing, while others are designed to cure after application. The appropriate type should be selected according to the customer's production process and operating environment.
Q: What is the difference between Thermal Gel and Thermal Grease?
A: Thermal gel generally provides better gap-filling and shape-retention capabilities, while thermal grease is primarily used for very thin interface layers. The appropriate choice depends on the required gap, assembly conditions, and long-term reliability requirements.
Q: Can Thermal Gel be used in battery packs?
A: Yes. Thermal gel can be applied between battery cells, modules, cooling structures, and other components requiring thermal management. The selected product should meet the battery pack's requirements for electrical insulation, flame resistance, temperature resistance, and long-term reliability.
Q: Is Thermal Gel suitable for AI servers?
A: Yes. For GPUs, CPUs, power components, and other components with significant height differences or complex structures, thermal gel provides excellent gap-filling capability and can help improve thermal transfer.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai