TIF100-15-11S Thermal Conductive Silicone Pad 1.5 W/mK for CPU GPU SSD Cooling 0.51-5.08mm Thickness
The TIF100-15-11S thermally conductive silicone pads are designed to fill air gaps between heat-generating components and heat dissipation surfaces. Their flexibility and elasticity make them ideal for uneven surfaces, effectively transferring heat to metal housings or cooling plates to enhance the efficiency and lifespan of electronic components.
- Excellent thermal conductivity: 1.5 W/mK
- Naturally tacky surface requiring no additional adhesive
- Soft and compressible for low-stress applications
- Available in various thicknesses from 0.51mm to 5.08mm
- RoHS compliant and UL recognized
- Fire rating: 94 V0 equivalent
- Cooling components to chassis or frame
- High-speed mass storage drives (SSD)
- LED TV backlight units and LED lighting systems
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- CPU, GPU, and display card cooling
- Motherboard and notebook thermal management
- Power supply heat dissipation
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Thickness Range | 0.020"-0.200" (0.51mm-5.08mm) | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temperature | -45°C to 200°C | - |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0×10¹² Ohm-meter | ASTM D257 |
| Fire Rating | 94 V0 | Equivalent UL |
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 |
Standard Sheet Sizes: 8" × 16" (203mm × 406mm)
Custom Die-Cut Shapes: Available upon request
Pressure Sensitive Adhesive: Single side (A1 suffix) or double side (A2 suffix)
Reinforcement: Fiberglass reinforced options available
Dongguan Ziitek Electronic Material Technology Co., Ltd., established in 2006, is a high-tech enterprise specializing in research, development, production, and sales of thermal interface materials. The company holds multiple certifications including ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, and UL recognition.
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