High-Speed SAS 4.0 29 Pin SMT Female Connector, 30U" Gold-Plated electricial Signal & Power Terminal terminals Connector with Peg and Locking Latch for Automotive & Server Applications
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
This SAS 29P SMT Female Connector is designed for high-speed electronic signal and power transmission in demanding server, storage and automotive systems. The connector adopts 30U" gold-plated contacts over 50U" nickel underplating, delivering excellent conductivity, corrosion resistance and long-term signal integrity. Solder tails are finished with 80U" matte tin over nickel, ensuring reliable wetting and strong joints on the PCB.
The connector uses a glass-filled LCP housing and cap (UL94-V0), offering high mechanical strength and heat resistance during SMT reflow soldering. Phosphor bronze C5191-H terminals provide stable contact force and durability throughout the product’s service life.
A positioning peg and fishhook-style latch help the connector sit accurately on the PCB and lock firmly into the mating plug, improving vibration resistance and assembly efficiency. Electrical performance includes 1.5A @ 40VAC per contact, ≤30mΩ contact resistance, ≥1000MΩ insulation resistance, and 500 mating cycles tested per EIA 364-09, making it suitable for continuous, high-reliability operation.
With HF + RoHS 2.0 compliance, this connector supports environmentally friendly manufacturing while meeting global industry standards, and is fully SAS 4.0 compatible for next-generation storage and server platforms.
| Product Type | SAS 29P SMT Female Connector with positioning peg and latch (fishhook) |
| Interface Standard | SAS 4.0 compatible |
| Contact Plating | Au 30U" (min) plated on contact area, over Ni 50U" (min) underplating |
| Solder Area Plating | Matte Sn 80U" (min) on solder tails, over Ni 50U" (min) underplating |
| Housing Material | LCP, glass-filled, Black, UL94-V0 |
| Cap Material | LCP, glass-filled, Black, UL94-V0 |
| Terminal Material | Phosphor Bronze C5191-H |
| Peg Material | Brass C2680-H, t=0.30mm, Ni 50U" min + Matte Sn 80U" min |
| Metal Clip Material | SUS304, t=0.15mm |
| Operating Temperature | –20°C to +85°C |
| Rated Current / Voltage | 1.5A @ 40VAC (per contact) |
| Contact Resistance | ≤ 30mΩ (Max) |
| Insulation Resistance | ≥ 1000MΩ (Min) |
| Withstand Voltage | 500VAC / minute |
| Mating Force | Backplane ≤ 25N (Max) |
| Unmating Force | Backplane ≥ 5N (Min) |
| Mating Durability | 200 cycles/hour max, up to 500 cycles (per EIA 364-09, backplane) |
| Salt Spray Test | Gold-plated area ≥ 48 hours |
| Environmental Compliance | HF + RoHS 2.0 compliant |
| Mounting Type | SMT (surface mount) for PCB |
| Special Features | Positioning peg and fishhook latch for secure alignment and retention |
Key Features
- 30U" gold-plated contacts with nickel underplating for low loss, stable high-speed signal transmission
- SMT PCB mounting with positioning peg and fishhook latch for precise alignment and strong mechanical retention
- Phosphor bronze terminals and LCP UL94-V0 housing for high strength and reflow-soldering reliability
- Rated 1.5A @ 40VAC, contact resistance ≤30mΩ, insulation resistance ≥1000MΩ
- Tested to 500 mating cycles (EIA 364-09) with controlled mating/unmating forces (≤25N / ≥5N)
- Gold-area salt spray performance ≥48 hours for enhanced corrosion resistance
- HF + RoHS 2.0 compliant, suitable for global electronic and electrical equipment markets
- Supports SAS 4.0, ideal for next-generation high-speed storage and server systems
⚙️ Applications
1. Server & Storage Devices
SAS HDD/SSD modules
RAID controller boards
Server backplanes
High-speed data transmission lines
2. Communication Equipment
Network routers and switches
Optical-electrical conversion modules
Edge computing devices
3. Automotive Electronics
ADAS data modules
In-vehicle storage interfaces
ECU signal connectors
4. Industrial Control Systems
PLC controllers
Industrial computers
Data acquisition boards
5. PCB & High-Speed Signal Designs
Multi-board connectivity
Fine-pitch high-density boards
High-speed signal routing applications
⚠️ Notes
- Design the PCB pads and stencil openings according to the SMT footprint recommended in the drawing to ensure proper solder fillet and coplanarity.
- Follow a suitable reflow temperature profile compatible with LCP UL94-V0 materials to avoid deformation or discoloration.
- Keep contact areas clean and free from dust, oil or oxidation before mating; avoid touching terminals directly by hand.
- Do not exceed the specified mating/unmating forces and 500-cycle endurance to maintain terminal integrity and stable contact resistance.
- Store products in dry, anti-static packaging; use ESD-protected workstations when handling and assembling the connectors.
- Avoid corrosive environments beyond the specified 48-hour salt spray performance and respect the rated current/voltage to guarantee long-term reliability.
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