High-Speed SAS4.0 29Pin Female Cable Connector, 180° Wire Solder Type with Peg & SUS Clip, 15U" Gold Electronic Connector for PCB Signal & Power Customization
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
The SAS 29P 180° Female Cable Connector is designed for high-speed electronic signal and power transmission in SAS4.0 server, storage and industrial systems. This wire-solder type connector features a positioning peg and stainless-steel clip, helping the cable connector align precisely with the mating connector and providing secure mechanical retention in demanding environments.
Each terminal is made from phosphor bronze C5191 and plated with 15U" gold on the contact area over 50U" nickel, delivering low contact resistance and excellent corrosion resistance. The solder & crimp area uses 80U" minimum matte tin plating, ensuring strong, reliable wire termination for cable assemblies.
The housing and base are produced from glass-filled LCP (UL94-0, black), offering high mechanical strength and heat resistance during soldering. Electrical performance includes a rated 1.5A @ 40VAC, ≤30mΩ contact resistance, ≥1000MΩ insulation resistance, and 500VAC dielectric withstand, providing stable signal integrity for SAS backplanes and wiring harnesses.
Designed as a 180-degree cable connector, this female connector is ideal for custom wire and cable solutions where space is limited but reliable server and storage transmission is required.
| Product Type | SAS “dummy” 29P Female Cable Connector, 180° wire-solder type with positioning peg & metal clip |
| Interface Standard | Supports SAS 4.0 |
| Rated Current / Voltage | 1.5A @ 40VAC |
| Operating Temperature | –20°C to +85°C |
| Contact Resistance | ≤ 30mΩ (Max) |
| Withstand Voltage | 500VAC / minute |
| Insulation Resistance | ≥ 1000MΩ (Min) |
| Terminal Plating – Base | Gold under Nickel 50U" (min); Nickel under tin area not controlled |
| Contact Area Plating | Au 15U" (min) plated on contact area over Ni underlayer |
| Solder & Crimp Area Plating | Tin 80U" (min) plated on solder & crimp area |
| Housing Material | LCP G/F, Black, UL94-0 (housing) |
| Base Material | LCP G/F, Black, UL94-0 (base) |
| Terminal Material | Phosphor Bronze C5191, t = 0.25mm |
| Metal Clip Material | SUS stainless steel, t = 0.15mm |
| Mating Force | Cable side ≤ 50N (Max) |
| Unmating Force | Cable side ≥ 5N (Min) |
| Mating Durability | Up to 25 cycles per cable, 200 cycles/hour max (per specification) |
| Salt Spray Test (Gold Zone) | ≥ 24 hours (gold plating area); tin area salt spray not controlled |
| Mounting Type | Wire solder / crimp cable connector, 180° orientation |
| Special Features | Positioning peg for accurate alignment; SUS metal clip for mechanical retention |
Key Features
- 15U" gold-plated contact area over 50U" nickel for low-loss, stable high-speed signal transmission
- 80U" tin plating on solder & crimp area for strong cable termination and reliable electrical connection
- LCP G/F housing & base (UL94-0) provide high strength and heat resistance for reflow or hand soldering
- Phosphor bronze C5191 terminals ensure elastic contact force and long-term durability
- Positioning peg and SUS metal clip improve assembly accuracy and vibration resistance in cable harnesses
- Rated 1.5A @ 40VAC, contact resistance ≤30mΩ, insulation resistance ≥1000MΩ for robust electrical performance
- Tested up to 25 mating cycles per cable (200 cycles/hour max) suitable for repeated plugging in lab and system tests
- Supports SAS4.0, ideal for next-generation server, data center and storage equipment
⚙️ Applications
1. Server & Storage Devices
SAS HDD/SSD modules
RAID controller boards
Server backplanes
High-speed data transmission lines
2. Communication Equipment
Network routers and switches
Optical-electrical conversion modules
Edge computing devices
3. Automotive Electronics
ADAS data modules
In-vehicle storage interfaces
ECU signal connectors
4. Industrial Control Systems
PLC controllers
Industrial computers
Data acquisition boards
5. PCB & High-Speed Signal Designs
Multi-board connectivity
Fine-pitch high-density boards
High-speed signal routing applications
⚠️ Notes
- Design the PCB pads and stencil openings according to the SMT footprint recommended in the drawing to ensure proper solder fillet and coplanarity.
- Follow a suitable reflow temperature profile compatible with LCP UL94-V0 materials to avoid deformation or discoloration.
- Keep contact areas clean and free from dust, oil or oxidation before mating; avoid touching terminals directly by hand.
- Do not exceed the specified mating/unmating forces and 500-cycle endurance to maintain terminal integrity and stable contact resistance.
- Store products in dry, anti-static packaging; use ESD-protected workstations when handling and assembling the connectors.
- Avoid corrosive environments beyond the specified 48-hour salt spray performance and respect the rated current/voltage to guarantee long-term reliability.
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