IDC 20-Pin Dual-Row Fully-Shrouded Male Connector | 2.00mm Pitch Electronic PCB Pin Header Terminal Connector for Wire Harness & Industrial Applications
Product Description
This IDC 20-Pin Dual-Row Fully-Shrouded Male Connector is designed for reliable PCB-to-wire and PCB-to-PCB electrical interface applications. The fully-enclosed housing provides enhanced mechanical protection and ensures secure mating with IDC ribbon cables. Its 2.00mm pitch, exposed gold-flash terminals, and reinforced pin structure deliver excellent conductivity, signal stability, and long-term durability.
The connector is suitable for electronic devices requiring compact, stable, and high-density pin configurations. Gold-flash plating improves corrosion resistance, supports consistent transmission quality, and ensures dependable performance in demanding industrial environments.
| Connector Type | IDC Dual-Row Fully-Shrouded Male Connector |
| Pin Count | 20 pins (2×10) |
| Pitch | 2.00 mm |
| Mounting Style | Through-hole pin header, solder-type |
| Housing Material | Thermoplastic, high-temperature resistant |
| Contact Material | Copper alloy |
| Plating | Gold-flash (G/F), exposed pin length approx. 3.2 mm |
| Current Rating | 1 A per pin (typical IDC spec) |
| Voltage Rating | 250V AC/DC (typical) |
| Contact Resistance | ≤ 30 mΩ |
| Insulation Resistance | ≥ 1000 MΩ |
| Dielectric Withstanding Voltage | 500V AC/minute |
| Durability | ≥ 500 cycles |
| Operating Temperature | −40°C to +105°C |
| Compliance | RoHS, environmental-grade plating |
| Customization | Pin count, plating thickness, housing color, wire termination available |
Applications
Computer servers and data-storage equipment
Industrial control systems and automation devices
Consumer electronics and smart home products
Automotive electronic modules and dashboard units
Communication devices, routers, network boards
Testing instruments and measurement equipment
Custom wire harness assemblies and PCB assemblies
Precautions
Ensure proper alignment with the mating IDC ribbon cable before applying pressure.
Avoid excessive bending of the pins during assembly to maintain signal integrity.
Recommended to follow PCB layout dimensions from the technical drawing for optimal soldering.
Use in dry environments or ensure proper enclosure protection if moisture exposure is expected.
For high-current or high-frequency applications, confirm compatibility with system requirements.
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