Micro-Fit 3.0 Pin Header 3.0mm Pitch 2×12 Vertical PCB Power & Signal tyco Connector with Peg, Tin-Plated Terminals for Automotive, Server & IDC Wire

This Micro-Fit 3.0 2×12 pin header connector is optimized for high-density, high-current power and signal transmission on compact PCBs.
The 3.0 mm pitch, dual-row 24-pin layout provides abundant circuits for mixed power and control signals while keeping the footprint small. Square copper-alloy pins and stamped solder tabs are finished with 50 μ" nickel and 100 μ" tin plating, delivering low contact resistance, strong solderability and excellent corrosion resistance even after 24-hour salt-spray testing.

With a rated current of 12.5 A per circuit at 250 V AC/DC, this connector is ideal for low-voltage power rails and robust signal links.
The vertical through-hole structure with locating peg ensures accurate PCB positioning and strong mechanical anchoring, maintaining stability under vibration, cable pull and repeated mating cycles. Glass-fiber-reinforced LCP housings rated UL94 V-0 and halogen-free withstand lead-free soldering profiles and an operating temperature range of −40 °C to +105 °C, making the connector suitable for harsh industrial and automotive environments.

⚙️ Applications

• PCB Signal & Data Transmission: Used for board-to-board or board-to-module connections, including low-voltage signals, data transmission, and control interfaces.
• Consumer Electronics: Common in smart home appliances, printers, cameras, displays, controllers, and handheld devices for internal signal routing.
• Industrial Automation & Control Systems: Applied in PLCs, industrial control boards, sensors, meters, robotics modules, and automation I/O interfaces.
• Servers & Data Center Equipment: Used for backplane interfaces, storage modules, communication boards, and signal expansion connectors.
• Automotive Electronics: Suitable for ECUs, BMS modules, sensor units, dashboards, infotainment systems, and on-board control interfaces.
• Communication & Networking Devices: Used in routers, switches, IoT gateways, RF modules, and network communication cards.
• IoT & Smart Device Modules: Applied in Bluetooth modules, WiFi modules, GPS/Beidou modules, sensor nodes, and embedded system expansion ports.
• Power Control & Monitoring Boards: For auxiliary power transmission, monitoring signals, and low-power control circuits.
• Custom OEM/ODM Electronic Designs: Ideal for designs requiring customizable pin count, pitch, height, plating option, and configuration.

⚠️ Notes

• Ensure Correct Pin Alignment: Check orientation and positioning before mating to avoid mis-insertion, bent pins, or PCB pad damage.
• Do Not Exceed Electrical Ratings: Follow the specified current and voltage limits to prevent overheating or contact failure.
• Proper Insertion and Extraction Force: Avoid excessive force during mating/unmating to prevent deformation, cracked solder joints, or pin damage.
• Keep Contact Surfaces Clean: Ensure terminals remain free from dust, oil, oxidation, or contaminants that reduce conductivity.
• Follow Recommended Soldering Conditions: Use appropriate soldering temperature profiles according to plastic materials such as LCP, PA6T, PA66, or PBT.
• Verify PCB Hole Tolerance: Incorrect hole size may cause inadequate solder filling or mechanical instability.
• Avoid Mechanical Stress After Assembly: Do not apply lateral pressure or bending forces, especially for SMT pin headers.
• Maintain Proper Storage Conditions: Store in a dry, dust-free environment to prevent terminal oxidation; use anti-static packaging if required.
• Confirm Compatibility with Female Header: Ensure matching pitch, pin count, height, and contact design to avoid mating failure.
• Choose Correct Plating Specification: Select proper plating (gold, tin, nickel) based on your application’s durability, corrosion resistance, and signal reliability needs.