Product Description
This compact PCB female connector uses a 1.00 mm fine pitch to deliver high-density routing on crowded boards while maintaining reliable electrical performance. Multi-pin SMT terminals provide stable signal and low contact resistance for data and control lines in compact electronic assemblies.
The connector housing is molded from high-temperature, flame-retardant thermoplastic, compatible with standard reflow processes. Precision-formed copper-alloy contacts with tin or selective gold plating ensure long-term durability, stable mating cycles and robust signal integrity in vibration-prone environments. OEM/ODM customization is available for different pin counts, keying structures, plating options and matched cable or wire harness solutions.
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| Connector type |
PCB female connector, single row, multi-pin |
| Pitch |
1.00 mm (other pitches customizable on request) |
| Number of positions |
6–10 pins optional, custom pin counts available |
| Mounting style |
Surface-mount (SMT) on PCB |
| Orientation |
Right-angle, low-profile |
| Contact type |
Female signal terminals |
| Contact material |
Phosphor bronze or equivalent high-strength copper alloy |
| Contact plating |
Tin or selective gold over nickel, optimized for low contact resistance |
| Housing material |
High-temperature thermoplastic, UL94V-0, halogen-free option |
| Rated current |
up to 1.0 A per pin (depending on layout and ambient temperature) |
| Rated voltage |
up to 50 VAC / 50 VDC |
| Insulation resistance |
≥ 1,000 MΩ at 500 VDC |
| Contact resistance |
≤ 30 mΩ (initial) |
| Dielectric withstand |
250 VAC, 1 minute |
| Operating temperature |
−40 °C to +105 °C |
| PCB termination |
SMT solder pads, suitable for automated reflow |
| Packaging |
Tape & reel or tray for automatic pick-and-place |
| Compliance |
RoHS, HF, REACH compliant; automotive/industrial grade available |
| Customization |
Special pin mapping, keying, plating thickness and wire harness assemblies |
Applications
Control boards and interface modules in industrial and factory automation equipment
Automotive electronic control units, infotainment systems and body control modules
Server and storage transmission boards, communication base-stations and network devices
Consumer and IoT electronics requiring compact board-to-board or board-to-cable interconnection
Power and low-voltage signal distribution within battery management or monitoring PCBs
Precautions
Design PCB pads and solder mask strictly according to the recommended land pattern to ensure proper solder fillet and coplanarity.
Avoid exceeding specified current and voltage ratings; derate appropriately at elevated ambient temperatures.
Follow standard SMT reflow temperature profiles suitable for high-temperature thermoplastic; avoid multiple reflow cycles beyond connector specifications.
Keep contacts free from flux residues, dust or oil; contamination may increase contact resistance or reduce insulation performance.
When used in high-vibration automotive or server applications, ensure mating connector or cable assembly includes suitable retention features and strain relief.
Store connectors in their original packaging, in a dry environment, to prevent terminal oxidation before assembly.
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