Product Description
This connector combines multiple gold-plated signal pads with robust power contacts in a compact board-to-board design. The long bottom contact pads provide stable, low-resistance transmission for high-current and high-density circuits, while the upper stamped contacts ensure reliable spring force and mechanical retention. Gold over nickel plating on the mating area improves corrosion resistance and long-term conductivity, suitable for repeated mating cycles. The high-temperature LCP housing supports automated SMT processes and maintains dimensional stability under reflow soldering. Custom pin count, plating thickness and layout can be provided to match specific power and signal distribution requirements.
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| Connector type |
Board-to-board combined power and signal connector |
| Pitch |
2.54 mm (signal contacts) |
| Positions |
4 power contacts + 16 signal contacts (total 20 positions) |
| Termination |
SMT contacts to PCB |
| Contact material |
Copper alloy, high conductivity |
| Contact plating |
Gold over nickel on mating area, tin on solder area |
| Housing material |
High-temperature LCP, UL94 V-0 |
| Rated current |
Up to 3 A per power contact, 1.0 A per signal contact (reference value) |
| Rated voltage |
Up to 50 V AC/DC |
| Contact resistance |
≤ 30 mΩ (initial) |
| Insulation resistance |
≥ 1000 MΩ |
| Dielectric withstanding voltage |
500 VAC, 1 minute |
| Operating temperature |
-40 ℃ to +105 ℃ |
| Mating style |
Vertical board-to-board, blind-mate compatible design |
| Environmental compliance |
RoHS / HF / REACH compliant |
Applications
Server and storage backplanes requiring shared power and signal interfaces
Industrial control boards and communication modules with compact power distribution
Embedded computers, IPCs and edge devices with hot-swappable daughter cards
Power boards and logic boards in automotive electronics and smart equipment
Customized power/signal harnesses for OEM and ODM projects
Precautions
Do not exceed the recommended current and voltage ratings on any contact.
Follow the specified reflow soldering profile and avoid repeated overheating of the housing.
Ensure accurate PCB footprint and coplanarity to prevent solder bridging or open contacts.
Keep the gold-plated mating area clean and free from flux, dust or fingerprints before assembly.
Avoid excessive mechanical stress, twisting or pulling on the connector during insertion and removal.
Store products in a dry, dust-free environment and use within the recommended shelf life for best performance.
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