Product Description
This SATA 22-pin connector combines power and high-speed signal transmission in a compact 1.27 mm pitch housing, ideal for slim storage devices and embedded systems. Gold-plated contacts on a nickel base ensure low contact resistance, excellent conductivity and corrosion resistance over long service life. Tin-plated solder tails provide reliable SMT soldering and stable mechanical retention on the PCB.
The high-temperature, flame-retardant insulator supports reflow soldering, while the low profile body allows tight stacking inside servers and industrial controllers. Custom options are available for different pin counts, keying styles, plating thickness and housing structures to match specific PCB layouts and cable assemblies.
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| Connector type |
SATA 22-pin board-to-board / board-to-cable connector, signal + power combined |
| Pitch |
1.27 mm housing pitch |
| Number of contacts |
22 pins (data + power), other pin counts customizable |
| Mounting style |
SMT mounting to PCB, with positioning features |
| Rated current & voltage |
1.5 A per contact, 40 VAC rated |
| Contact resistance |
≤ 30 mΩ (initial) |
| Insulation resistance |
≥ 1000 MΩ |
| Withstand voltage |
500 VAC / minute between contacts and housing |
| Contact plating |
Ni under-plating, gold flash on contact area, tin on solder tail |
| Insulator material |
High-temperature thermoplastic, UL94-V0, black |
| Operating temperature |
−20 °C to +85 °C |
| Compliance |
RoHS 2.0, HF, REACH-compliant materials |
Applications
Server and data-center storage backplanes, HDD/SSD docking boards
Industrial control and automation units requiring compact SATA power & signal connectors
Embedded PCs, DVR/NVR, medical and instrumentation equipment with limited space
Automotive infotainment and telematics modules using SATA-based storage
Customized cable assemblies and wire harnesses for OEM storage solutions
Precautions
Verify pin assignment and SATA standard compatibility before designing the PCB footprint.
Keep connector areas free from flux residue and contamination to maintain low contact resistance.
Avoid exceeding the rated current per contact; distribute power lines appropriately on multi-drive boards.
Ensure correct PCB pad design and reflow profile to prevent solder bridging between fine-pitch terminals.
Do not insert or remove mating parts under load or strong vibration to minimize wear on the gold plating.
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