Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated Foil for Low Noise Block
Double Layer PCB Special Material Rogers Board 20.7mil Rogers Ro4003c Lopro Reverse Treated
Foil for Low Noise Block, 1.2mm thick.
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro Laminates by Rogers Corporation:
Product Description:
RO4003C LoPro laminates utilize Rogers' proprietary technology, enabling the bonding of reverse treated foil
to the standard RO4003C dielectric. This results in a laminate with minimal conductor loss, enhancing insertion
loss characteristics and signal integrity while retaining all other favorable attributes of the standard RO4003C
system.
Features and Benefits:
Reinforced Hydrocarbon/Ceramic Laminates: RO4003C materials feature reinforced hydrocarbon/ceramic
composition with a low-profile reverse treated foil.
Lower Insertion Loss: Reduced conductor loss leads to lower insertion loss, improving signal transmission
efficiency.
Low PIM (Passive Intermodulation): Enhanced design minimizes passive intermodulation effects, ensuring
signal purity.
Increased Signal Integrity: Maintains high signal integrity, crucial for reliable performance in high-frequency
applications.
High Circuit Density: Supports high circuit density layouts, enabling compact and efficient PCB designs.
Low Z-Axis Coefficient of Thermal Expansion:
Multi-Layer Board Capability: Facilitates the construction of multi-layer boards without compromising performance.
Design Flexibility: Offers design flexibility for complex PCB layouts and diverse applications.
Lead-Free Process Compatible:
High-Temperature Processing: Compatible with high-temperature processes, ensuring robust performance under
varying conditions.
Environmental Compliance: Meets environmental standards by providing a lead-free solution, addressing environmental concerns and regulations effectively.
Our PCB Capability (RO4003C LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4003C LoPro |
| Dielectric constant: | 3.38±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Applications:
1.Digital Applications:
RO4003C LoPro laminates are well-suited for digital applications like servers, routers, and high-speed backplanes,
ensuring reliable signal transmission and low insertion loss in data processing systems.
2.Cellular Base Station Antennas and Power Amplifiers:
Ideal for cellular base station antennas and power amplifiers, providing high signal integrity and performance crucial
for robust wireless communication networks.
3.LNBs for Direct Broadcast Satellites:
Utilized in Low-Noise Blocks (LNBs) for direct broadcast satellites, optimizing signal reception and processing for satellite TV and communication services.
4.RF Identification Tags:
Used in RF identification tags, facilitating accurate and efficient data exchange for identification and tracking purposes in various industries and applications.
Typical Properties of RO4003C LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 14 | y | ||||
| 46 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-Free Process Compatible | Yes |
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