Eaststar New Material (Tianjin) Limited
                                                                                                           
Verified Supplier
8 Years
Since 2018
Menu

1.5-2.0mm FPC Press Pad Flexible PCB Cushion Pad ESCP-FPC-G3 | 100-200 Cycle Life | ≤260°C Heat Resistance

Price Negotiable
Price: negotiable
MOQ: 10PCS
Delivery Time: 10-20days after receiving the prepayment
Brand: EastStar
Product Description
ESCP-FPC-G3 Flexible PCB Cushion Pad
Product Overview

The ESCP-FPC-G3 is a specialized 1.5-2.0mm FPC press pad designed for hot lamination buffering during flexible printed circuit board manufacturing. This high-performance cushion pad offers superior lamination performance and stability, significantly improving yield and efficiency in flexible PCB and flexible-rigid PCB lamination processes.

Technical Specifications
Parameter Specification
Service Life 100-200 cycles
High Temperature Resistance ≤260°C
Thickness 1.5-2.0mm
Thickness Tolerance ±0.3mm
Size Tolerance (Length/Width) ±2mm
Tensile Strength ≥ 25 MPa
Buffer Standard ≥ 12%
Water Absorption < 8% (3-8%)
Key Features & Benefits
  • Extended Service Life: Reusable for 100-200 lamination cycles, reducing production costs significantly
  • Superior Performance: Excellent flatness, wear resistance, and dimensional stability outperforming traditional Kraft paper
  • High Temperature Durability: Maintains integrity at temperatures up to 260°C without carbonization or brittleness
  • Optimal Buffering & Thermal Conductivity: Stable compression and expansion coefficients with excellent tear resistance
  • Safety & Cleanliness: Flame retardant, non-toxic, odorless, dust-free with good breathability
  • Cost Efficiency: Replaces multiple Kraft paper sheets, saving at least 20% on production material costs
Material Composition
  • Silastic
  • High elasticity fiber
  • High molecular weight polymer
  • Tensile tear layer
Product Images
ESCP-FPC-G3 Flexible PCB Cushion Pad product view showing thickness and material structure
ESCP-FPC-G3 Cushion Pad technical specifications and application in PCB lamination process
Application Notes

Also known as FPCB lamination cushion press pad, FPC cushion mat, FPCB buffering pad, or FPCB hot press pad. This essential buffering material is critical for completing the flexible PCB lamination process in automated PCB manufacturing operations.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Eaststar New Material (Tianjin) Limited
Location F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person Elon Bin

Request A Quote

Please check your email address.
Your message must be at least 20 characters.