PCB Silicon Lamination Cushion Pad 4-6.5mm Thickness for FPCB Hot Press Applications
Price:
Negotiable
MOQ:
20pcs
Delivery Time:
around 10-15 days for small quantity, 20-30days for large quantity
Brand:
Estar
Product Description
Product Overview
Specialized PCB silicon lamination cushion pads designed for FPCB hot press applications, providing essential protection and support during the lamination process. These pads serve as superior replacements for traditional Kraft paper in PCB manufacturing.
Key Features
- High electrical insulation properties for sensitive electronic components
- Excellent shock absorption and compression resistance
- Superior abrasion endurance and chemical reagent resistance
- Low water absorption rate < 8%
- Available in multiple colors: Red, White, Grey, etc.
Technical Specifications
| Parameter | Specification |
|---|---|
| Thickness Range | 4-6.5mm or customizable |
| Standard Sizes (L*W) | 1500*1300mm, 1300*780mm, 1170*690mm, 1160*665mm, 1180*660mm, 1295*788mm 27.5"*24", 45"*51", 59"*51" (inches) |
| Water Absorption Rate | < 8% |
| Shape | Rectangular |
| Package | Plywood case for exporting |
Applications
Ideal for lamination processes of PCBs, rigid-flexible boards, FPCs, high count layers, multi-layer boards, metal substrates, and thick copper coin or heat sink boards. Provides accurate heat transfer control and pressure balance during pressing operations.
Manufacturing & Supply
Origin: China
Minimum Order: 20pcs
Supply Capacity: 10,000 Square Meters per week
Payment Terms: T/T, D/P, L/C, Western Union, MoneyGram
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin