ESRF-3in1 25-500μm 3-Layer Release Film for Rigid-Flexible PCB and RF-PCB Lamination
Price:
negotiable
MOQ:
10rolls
Delivery Time:
10-20days after receiving prepayment
Brand:
EastStar
Product Description
3-in-1 Release Film for PCB Lamination
Product Overview
This 3-in-1 release film is specifically designed for filling and covering applications during the compression and lamination processes of rigid-flexible PCBs and RF-PCBs. Available in thicknesses ranging from 25-500μm, it provides essential protection and performance for advanced circuit board manufacturing.
Product Specifications
| Model | Thickness Range | Structure | Surface Finish |
|---|---|---|---|
| ESRF-3in1 | 25-500μm | 3 Layers | Matte or Glossy |
Multi-Layer Structure
- Release Layer
- Covering Layer
- Release Layer
Key Performance Features
- Superior temperature resistance for demanding lamination processes
- Accommodates height variations across different rigid-flexible board configurations
- Excellent dimensional stability with minimal expansion/contraction after lamination
- Compatible with various core layer specifications and sizes
Technical Parameters
- Model: ESRF-3in1
- Thickness: 25-500μm
- Structure: 3-layer construction
- Surface Options: Matte or glossy finishes available
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Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin