Mechanical Polishing Wafer Frame Ring 0.6-1.2 Inch Stainless Steel Dicing Frame HRC48-55
Price:
negotiable
MOQ:
50pcs
Delivery Time:
10-20days after receiving advance payment
Brand:
EastStar
Product Description
EASTAR Mechanical Polishing Wafer Frame Ring
Professional stainless steel wafer frame rings designed for semiconductor manufacturing applications, providing reliable protection and positioning during wafer processing operations.
Product Specifications
| Material | Dura420/SUS420J2 Stainless Steel |
|---|---|
| Available Sizes |
0.6 inch: External Φ228mm / Internal Φ194mm / Thickness 1.2mm
0.8 inch: External Φ276mm / Internal Φ250mm / Thickness 1.2mm
1.2 inch: External Φ400mm / Internal Φ350mm / Thickness 1.5mm
|
| Surface Treatment | Mechanical Polishing (glossy surface Ra<0.15μm) |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
Key Features
- Extremely lightweight with reliable shaping performance
- Ergonomic design for safe wafer and chip handling
- Withstands high temperature and energy during UV laser marking
- Prevents chip damage and edge fragmentation
- Available in circular, square, and custom shapes
Applications
Primarily used in laser marking processes for wafers and chips, providing essential protection and positioning limits during semiconductor manufacturing operations. Suitable for global wafer producers requiring precision components.
Customization Options
All shapes and sizes can be customized according to user specifications and technical drawings.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin