4mm-6.5mm High Temperature PCB Press Cushion Pad - 280℃ Resistant, 300-500 Cycle Life
ESCP-PCB-G2 rigid PCB cushion pad is specifically engineered for hot lamination buffering during rigid printed circuit board manufacturing. This red rigid cushion press pad effectively replaces traditional hot press kraft paper, significantly improving dimensional safety and stability while enhancing production yield and efficiency.
| Parameter | Specification |
|---|---|
| Service Life | 300-500 cycles |
| Temperature Resistance | ≤280℃ |
| Thickness (Top/Bottom) | 4mm-6.5mm |
| Thickness (Middle Layer) | 1.5-2.0mm |
| Thickness Tolerance | ±0.3mm |
| Standard Sizes | 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm |
| Size Tolerance | ±2mm |
| Tensile Strength | ≥25 MPa |
| Buffer Standard | ≥12% |
| Water Absorption | <8% (3-8%) |
- Extended service life of 300-500 cycles significantly reduces PCB production costs
- Superior performance in flatness, wear resistance, and dimensional stability compared to kraft paper
- High temperature resistance up to 280℃ without carbonization or brittleness
- Excellent buffering effect with stable compression and expansion coefficients
- Flame retardant, non-toxic, odorless, and dust-free with good breathability
Multi-layer construction includes: nano high temperature resistant coating, fiberglass cloth, high molecular weight polymer, tensile tear layer, polymer aggregates, and additional fiberglass cloth layers.
Ideal for both manual operations and automated PCB laminating systems. Replaces multiple sheets of hot press kraft paper with a single pad, reducing production material costs by at least 20% while improving operational efficiency.
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