228mm Metal Wafer Frame Ring SUS420J2 Stainless Steel for Wafer Dicing with HRC48-55 Hardness
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
EASTAR® wafer frame rings are precision-engineered circular metal rings designed to protect wafer and chip edges during laser marking processes. These ergonomic rings provide secure support for shipping and handling operations while withstanding high temperatures and energy during UV laser processing.
Key Features & Benefits
- Ergonomic design for safe wafer and chip handling
- Extremely lightweight with reliable shaping performance
- Withstands high temperature and energy during UV laser marking
- Prevents chip damage and edge fragmentation
- Trusted by wafer producers globally
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Dura420/SUS420J2 Stainless Steel |
| Available Sizes |
6" (Φ228mm/Φ194mm/1.2mm) 8" (Φ276mm/Φ250mm/1.2mm) 12" (Φ400mm/Φ350mm/1.5mm) |
| Surface Treatment | Mechanical Polishing (glossy Ra<0.15μm, matte Ra>0.3μm, mirror Ra<0.05μm) |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
Customization Options
Available in inner circular shape, inner square shape, and special customized shapes. All dimensions and configurations can be customized according to customer drawings and specifications.
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Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin