36-100μm PET Substrate Release Film for Rigid PCB Lamination - ESRF2 Series with High Temperature Resistance
Price:
negotiable
MOQ:
50rolles
Delivery Time:
about 15days
Brand:
EastStar
Product Description
Product Overview
ESRF2 PET substrate release film is specifically engineered for rigid printed circuit board (R-PCB) lamination processes. This specialized functional film provides reliable isolation and separation during high-temperature PCB manufacturing.
Technical Specifications
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESRF2-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESRF2-36 | 36μm | - | - |
| ESRF2-50 | 50μm | - | - |
| ESRF2-75 | 75μm | - | - |
| ESRF2-100 | 100μm | - | - |
Applications
This release film is specifically designed for rigid PCB lamination processes, including:
- PCB blind hole board lamination
- Slotted board manufacturing
- Back panel production
Product Structure
Three-layer construction:
- Release layer
- High-temperature resistant PET substrate
- Release layer
Key Features
- Double matte surfaces for easier production handling
- Low static electricity minimizes dust and foreign object adsorption
- Reduced silicone oil transfer lowers contamination risk
- Superior high-temperature resistance for elevated lamination temperatures
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin