25μm-100μm Silicon Free Release Film Roll for FPC Lamination with Matte Finish and 10-35gf/inch Release Force
This silicon-free release film is a specialized functional material designed for flexible printed circuit board (FPC) manufacturing processes. Available in thicknesses from 25μm to 100μm with matte finish, it prevents oil transfer and contamination while ensuring smooth production operations.
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESFF1-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESFF1-36 | 36μm | 10-35gf/inch | Matte glossy |
| ESFF1-50 | 50μm | 10-35gf/inch | Matte glossy |
| ESFF1-75 | 75μm | 10-35gf/inch | Matte glossy |
| ESFF1-100 | 100μm | 10-35gf/inch | Matte glossy |
Specifically designed for FPC lamination processes requiring high adhesive resistance. Ideal for large surface FPC laminating, reinforcing steel sheets with tin plating requirements, and pressing soft metal surfaces in electronic manufacturing.
- TPX release layer
- Buffering layer
- TPX release layer
- Excellent dimensional stability for consistent performance
- Silicon-free surface prevents oil transfer and contamination
- Compatible with browned surface pressing requirements
- Superior adhesive resistance for various CVL pressing needs
Eliminates silicone-related issues that can affect coating, bonding, and printing processes. Provides smooth surface with stable release force, ensuring product integrity and cleanliness. Environmentally friendly with simplified waste disposal procedures. Customizable options available for specific industry requirements.
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