HRC48-55 Wafer Dicing Ring Frame - Dura420 Stainless Steel 6/8/12 Inch Sizes for Semiconductor Processing
Professional wafer protection solution with HRC48-55 surface hardness, manufactured from Dura420/SUS420J2 stainless steel for superior durability and performance in semiconductor processing.
EASTAR® wafer frame rings (also known as Wafer Dicing Rings, Wafer Metal Frames, or Wafer Ring Frames) are precision-engineered circular metal rings designed to protect wafer and chip edges during semiconductor manufacturing processes. These ergonomic rings provide safe support during wafer handling and shipping operations while featuring extremely light weight and reliable shaping performance.
| Parameter | Specification |
|---|---|
| Material | Dura420/SUS420J2 Stainless Steel |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
| Surface Treatment | Mechanical Polishing: glossy surface Ra<0.15μm, matte surface Ra>0.3μm, mirror surface Ra<0.05μm |
| Size | External Diameter | Inner Diameter | Thickness |
|---|---|---|---|
| 06 inches | Φ228mm | Φ194mm | 1.2mm |
| 08 inches | Φ276mm | Φ250mm | 1.2mm |
| 12 inches | Φ400mm | Φ350mm | 1.5mm |
EASTAR® wafer frame rings serve as circular or special-shaped metal rings used to protect wafer and chip edges, primarily employed in laser marking processes to provide protection and position limitation. These rings withstand high temperatures and energy during UV laser marking processes, preventing chip damage and edge fragmentation in semiconductor manufacturing.
- Inner circular shape configurations
- Inner square shape designs
- Special customized shapes per customer drawings
- All dimensions and specifications customizable to user requirements
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