ES-WFR-Dura420 Wafer Dicing Frame Ring 1.5mm Thickness HRC48-55 Hardness ±0.5mm Tolerance
Price:
negotiable
MOQ:
100pcs
Delivery Time:
10days after getting advance payment
Brand:
EastStar
Product Description
Product Overview
The ES-WFR-Dura420 wafer dicing frame ring is manufactured from German Dura420 high-hardness stainless steel, delivering exceptional performance for semiconductor wafer processing applications. This precision component provides secure support during wafer and chip handling, shipping, and processing operations.
Key Specifications
| Parameter | Specification |
|---|---|
| Material | German Dura420 Stainless Steel |
| Available Sizes | 6" (Φ228mm/Φ194mm/1.2mm), 8" (Φ276mm/Φ250mm/1.2mm), 12" (Φ400mm/Φ350mm/1.5mm) |
| Surface Treatment | Mechanical Polishing (Ra<0.15μm), Matte (Ra>0.3μm), Mirror (Ra<0.05μm) |
| Surface Hardness | HRC48-55 |
| Size Tolerance | ±0.5mm |
| Angle Tolerance | 0° 30″ |
| Flatness Level | <0.2mm |
| Available Shapes | Inner Circular, Inner Square, Custom Shapes |
Technical Features
- High hardness HRC48-55 for superior durability
- Precision surface finishes with Ra values from <0.05μm to >0.3μm
- ±0.5mm dimensional tolerance for consistent performance
- Lightweight construction with reliable shaping characteristics
- Custom shapes and sizes available per customer specifications
Applications
The wafer dicing frame ring serves as a protective circular or custom-shaped metal component that safeguards wafer and chip edges during laser marking processes. It provides essential protection and positional limits, withstanding high temperatures and energy during UV laser marking to prevent chip damage and edge fragmentation.
Product Images
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin