SUS420J2 Stainless Steel Wafer Frame Ring HRC48-55 Hardness 06/08/12 Inch Sizes for Semiconductor Protection

The ES-WFR-SUS420 wafer frame ring is manufactured from SUS420J2 high-hardness stainless steel plate, ensuring optimal performance as a protective metal ring for semiconductor wafers and chips. This martensitic stainless steel offers excellent mechanical properties and corrosion resistance, making it ideal for demanding industrial applications.

• Material: SUS420J2 stainless steel
• Surface Hardness: HRC48-55
• Size Tolerance: +/-0.5mm
• Angle Tolerance: 0° 30″
• Flatness Level: <0.2mm
• Surface Treatment: Mechanical Polishing with multiple finish options
• Available in inner circular, inner square, or custom shapes

The ES-WFR-SUS420 wafer frame ring provides secure support during wafer and chip shipping, handling, and processing operations. These wafer dicing rings feature extremely light weight and reliable shaping performance, making them essential for semiconductor manufacturers worldwide.

Also known as wafer dicing ring, wafer metal frame, wafer metal ring, wafer ring frame, or wafer frame ring, this component functions as a circular or special-shaped metal ring that protects wafer and chip edges. It is primarily used in UV laser marking processes to provide protection and positional limits, withstanding high temperatures and energy during processing to prevent chip damage and edge fragmentation.