Estar ESCP-FPC-G3 PCB Press Cushion Pad 1.5-2.0mm High Molecular Weight Polymer for FPCB Hot Press
The Estar ESCP-FPC-G3 PCB Press Cushion Pad is a high-performance flexible PCB press pad specifically engineered for FPCB hot press applications. Manufactured from durable high molecular weight polymer, this rectangular cushion pad provides exceptional electrical insulation and reliable performance under high pressure and temperature conditions.
- High electrical insulation properties for sensitive electronic components
- 1.5-2.0mm thickness range for customizable press requirements
- Excellent buffering effect and thermal conductivity
- Good chemical resistance and long-lasting durability
- Low water absorption rate (< 8%)
- Available in multiple colors (Red, White, Grey, etc.)
- Flexible packaging options: individual or roll packaging
| Parameter | Specification |
|---|---|
| Product Name | High-performance Flexible PCB Press Cushion Pad |
| Model Number | ESCP-FPC-G3 |
| Thickness Range | 1.5-2.0mm |
| Primary Material | High Molecular Weight Polymer |
| Shape | Rectangular |
| Water Absorption Rate | < 8% |
| Chemical Resistance | Good |
| Package Options | Individual or Roll |
This versatile cushion pad is ideal for various PCB lamination processes, particularly in flexible printed circuit board (FPCB) manufacturing. It provides essential support and protection during hot press applications, ensuring smooth and high-quality bonding of layers while preventing electrical interference.
Minimum Order Quantity: 20 pieces
Supply Capacity: 10,000 square meters per week
Accepted Payment Terms: T/T, D/P, L/C, Western Union, MoneyGram
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