Estar ESCP-FPC-G3 PCB Press Cushion Pad 1.5-2mm Thickness with 280°C Heat Resistance and 8% Water Absorption
Professional-grade cushioning solution for flexible printed circuit board (FPCB) manufacturing with exceptional temperature resistance and buffering properties.
The Estar ESCP-FPC-G3 PCB Press Cushion Pad is engineered for demanding FPCB hot press applications. This industrial-grade component provides superior cushioning, excellent tear resistance, and withstands temperatures up to 280°C, ensuring reliable performance in high-temperature manufacturing environments.
| Parameter | Specification |
|---|---|
| Thickness Range | 1.5-2.0mm (middle layer), 4.0-6.5mm (top/bottom) |
| Temperature Resistance | ≤280°C |
| Water Absorption Rate | < 8% |
| Tensile Strength | ≥ 25 MPa |
| Buffer Standard | ≥ 12% |
| Service Life | 300-500 cycles |
| Standard Sizes | 1500×1300mm, 1300×780mm, 1170×690mm, and custom dimensions |
- Excellent tear resistance for long-lasting performance
- High-temperature resistance up to 280°C maintains structural integrity
- Low water absorption rate < 8% ensures dimensional stability
- Superior buffering properties ≥ 12% for consistent PCB pressing
- Customizable sizes with thickness tolerance ±0.3mm
- Available in multiple colors: Red, White, Grey, and custom options
Ideal for flexible printed circuit board (FPCB) manufacturing, electronic component lamination, and precision PCB pressing applications where consistent pressure distribution and thermal stability are critical.
- Minimum Order Quantity: 20 pieces
- Delivery Time: 10-15 days (small quantities), 20-30 days (large quantities)
- Payment Methods: T/T, D/P, L/C, Western Union, MoneyGram
- Packaging: Strong plywood cases with protective cushioning
- Supply Capacity: 10,000 square meters per week
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