ESCP-PCB-G2 Polymer Rigid PCB Press Pad 4-6.5mm Thickness 300-500 Cycle Lamination Cushion Mat
Specialized cushion mat for rigid PCB lamination buffering with 300-500 use cycles and high temperature resistance up to 280°C.
The Rigid PCB Cushion Pad (ESCP-PCB-G2) is engineered specifically for hot lamination buffering during rigid printed circuit board manufacturing. This red polymer cushion press pad effectively replaces traditional hot press kraft paper, significantly improving dimensional safety and stability while enhancing production yield and efficiency.
- Extended Service Life: 300-500 lamination cycles, reducing production costs significantly
- Superior Performance: Excellent flatness, wear resistance, and dimensional stability outperforming kraft paper
- High Temperature Resistance: Operates continuously at temperatures up to 280°C without carbonization or brittleness
- Optimal Buffering: Excellent thermal conductivity, stable compression characteristics, and good tear resistance
- Safety & Cleanliness: Flame retardant, non-toxic, odorless, dust-free with good breathability
- Cost Efficiency: Replaces multiple kraft paper sheets, reducing material costs by at least 20%
- Nano high temperature resistant coating
- Fiberglass cloth reinforcement
- High molecular weight polymer core
- Tensile tear layer
- Polymer aggregates
- Fiberglass cloth backing
- Nano high temperature resistant coating
| Parameter | Specification |
|---|---|
| Service Life | 300-500 cycles |
| Temperature Resistance | ≤280°C |
| Thickness (Top/Bottom) | 4.0-6.5mm |
| Thickness (Middle Layer) | 1.5-2.0mm |
| Thickness Tolerance | ±0.3mm |
| Standard Sizes | 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm |
| Size Tolerance | ±2mm |
| Tensile Strength | ≥25 MPa |
| Buffer Standard | ≥12% |
| Water Absorption | <8% (3-8%) |
Top/Bottom Cushion Pad: 4.0-6.5mm thickness for outer layers of PCB lamination stack
Middle Layer Cushion Pad: 1.5-2.0mm thickness for intermediate buffering between PCB layers
Suitable for both manual operations with multiple sheet replacements and automated PCB laminating systems. Essential cushioning material for completing rigid printed circuit board lamination processes.
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