Eaststar New Material (Tianjin) Limited
                                                                                                           
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8 Years
Since 2018
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ESCP-PCB-G2 Polymer Rigid PCB Press Pad 4-6.5mm Thickness 300-500 Cycle Lamination Cushion Mat

Price Negotiable
Price: 100usd/pc
MOQ: 30pcs
Delivery Time: around 20days
Brand: ES
Product Description
ESCP-PCB-G2 Polymer Rigid PCB Press Pad

Specialized cushion mat for rigid PCB lamination buffering with 300-500 use cycles and high temperature resistance up to 280°C.

Product Overview

The Rigid PCB Cushion Pad (ESCP-PCB-G2) is engineered specifically for hot lamination buffering during rigid printed circuit board manufacturing. This red polymer cushion press pad effectively replaces traditional hot press kraft paper, significantly improving dimensional safety and stability while enhancing production yield and efficiency.

Key Features & Benefits
  • Extended Service Life: 300-500 lamination cycles, reducing production costs significantly
  • Superior Performance: Excellent flatness, wear resistance, and dimensional stability outperforming kraft paper
  • High Temperature Resistance: Operates continuously at temperatures up to 280°C without carbonization or brittleness
  • Optimal Buffering: Excellent thermal conductivity, stable compression characteristics, and good tear resistance
  • Safety & Cleanliness: Flame retardant, non-toxic, odorless, dust-free with good breathability
  • Cost Efficiency: Replaces multiple kraft paper sheets, reducing material costs by at least 20%
Product Structure
  • Nano high temperature resistant coating
  • Fiberglass cloth reinforcement
  • High molecular weight polymer core
  • Tensile tear layer
  • Polymer aggregates
  • Fiberglass cloth backing
  • Nano high temperature resistant coating
Technical Specifications
Parameter Specification
Service Life 300-500 cycles
Temperature Resistance ≤280°C
Thickness (Top/Bottom) 4.0-6.5mm
Thickness (Middle Layer) 1.5-2.0mm
Thickness Tolerance ±0.3mm
Standard Sizes 1500×1300mm, 1300×780mm, 1170×690mm, 1160×665mm, 1180×660mm, 1295×788mm
Size Tolerance ±2mm
Tensile Strength ≥25 MPa
Buffer Standard ≥12%
Water Absorption <8% (3-8%)
Application Types

Top/Bottom Cushion Pad: 4.0-6.5mm thickness for outer layers of PCB lamination stack

Middle Layer Cushion Pad: 1.5-2.0mm thickness for intermediate buffering between PCB layers

Compatibility

Suitable for both manual operations with multiple sheet replacements and automated PCB laminating systems. Essential cushioning material for completing rigid printed circuit board lamination processes.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Eaststar New Material (Tianjin) Limited
Location F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person Elon Bin

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