3in1 Laminating Release Film Roll 25-500μm for RF-PCB Lamination with Temperature Resistance
Price:
100usd/pc
MOQ:
30pcs
Delivery Time:
around 20days
Brand:
ES
Product Description
3in1 Release Film for RF-PCB Lamination
Specialized release film designed for filling and covering during compression or lamination processes of rigid and flexible circuit boards (RF-PCB).
Product Applications
Ideal for compression and lamination processes in both soft and hard circuit board manufacturing (Rigid and Flexible PCB/RF-PCB applications).
Product Structure
- Release layer for easy separation
- Covering layer for protection
- Three-layer composite construction
Key Features & Benefits
- Superior temperature resistance for demanding manufacturing environments
- Accommodates height variations across different soft and hard board configurations
- Excellent dimensional stability with minimal expansion/contraction after lamination
- Compatible with various core layer specifications and sizes
Technical Specifications
| Model | Thickness Range | Structure | Surface Finish |
|---|---|---|---|
| ESRF-3in1 | 25-500μm (0.025-0.5mm) | 3 Layers | Matte or Glossy |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin