FPC Release Laminating Film Roll 25μm-100μm for Flexible Printed Circuit Board Manufacturing
Price:
100usd/pc
MOQ:
30pcs
Delivery Time:
around 20days
Brand:
ES
Product Description
FPC Release Film for Flexible Circuit Board Lamination
Specialized thin film designed specifically for flexible printed circuit board (FPC) lamination processes, providing essential isolation and separation functions during production.
Product Applications
This release film serves as a covering layer during FPC lamination, functioning as an isolation and separation medium. It is also utilized for false bonding and compression applications involving EML and FR4 materials.
Product Structure
- Release layer
- High-temperature resistant PET substrate
- Release layer
Key Features
- Double matte surfaces for enhanced production handling and operation
- Minimal surface static electricity to prevent dust and foreign object contamination
- Low silicone oil transfer to reduce pollution risks during lamination
Available Models & Specifications
| Model | Thickness | Release Force | Surface Finish |
|---|---|---|---|
| ESRF1-25 | 25μm | 10-35gf/inch | Matte glossy |
| ESRF1-36 | 36μm | - | - |
| ESRF1-50 | 50μm | - | - |
| ESRF1-75 | 75μm | - | - |
| ESRF1-100 | 100μm | - | - |
Available in multiple thickness options from 25μm to 100μm to meet various FPC lamination requirements and production specifications.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Eaststar New Material (Tianjin) Limited
Location
F3, No.843, Shengli Street, Dagang, Binhai New Area, Tianjin, PR. China 300270
Contact Person
Elon Bin